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MachXO3 Starter Kit User Guide
Figure 2. MachXO3 Board (MachXO3L Version), Bottom Side
SPI Flash Boot
Memory (U6)
Storage and Handling
Static electricity can shorten the lifespan of electronic components. Please observe these tips to prevent damage
that could occur from electro-static discharge:
• Use anti-static precautions such as operating on an anti-static mat and wearing an anti-static wrist-band.
• Store the evaluation board in the packaging provided.
• Touch a metal USB housing to equalize voltage potential between you and the board.
Software Requirements
You should install the following software before you begin developing new designs for the Starter Kit:
• Lattice Diamond
®
design software
• FTDI Chip USB hardware drivers (installed as an option within the Diamond installation program)
MachXO3 Device
This board currently features the MachXO3L-6900C FPGA which offers embedded Non-Volatile Configuration
Memory (NVCM) technology or the MachXO3LF-6900C FPGA which offers embedded Non-Volatile Flash technol-
ogy for instant-on operation in a single chip. Numerous system functions are included, such as two PLLs and 256
kbits of embedded RAM plus hardened implementations of I
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C and SPI. Flexible, high performance I/Os support
numerous single-ended and differential standards including LVDS. The 256-ball BGA package provides up to 206
user I/Os in a 14 mm x 14 mm form factor. A complete description of this device can be found in the