
Dear customer
LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1
st
day of October,
2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which
LAPIS established a new company, LAPIS Technology Co., Ltd.
(“LAPIS
Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business.
Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"
and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."
Furthermore, there are no changes to the documents relating to our products other than
the company name, the company trademark, logo, etc.
Thank you for your understanding.
LAPIS Technology Co., Ltd.
October 1, 2020
Содержание ML630Q791
Страница 2: ...FEBL630Q791 01 ML630Q791 SDK BOARD Hardware Manual ML630Q791 Demo Kit Issue Date Jun 12 2015...
Страница 9: ...Chapter 2 General Description This chapter gives a general description of the ML630Q791SDK Board...
Страница 15: ...Chapter 3 Setting This chapter gives a Setting opreating mode of the ML630Q791 SDK Board...
Страница 18: ...Chapter 4 Connectors This chapter describes the connectors mounted on the ML630Q791 SDK Board...
Страница 22: ...Chapter 5 Notes This chapter describes the Notice when ML630Q791 SDK Board is used...
Страница 24: ...Chapter 6 Schematics This chapter describes the schematics of ML630Q791 SDK Board...
Страница 26: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 2 FEBL630Q791 01...
Страница 27: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 3 FEBL630Q791 01 6 2 CPU board...
Страница 28: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 4 FEBL630Q791 01...
Страница 29: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 5 FEBL630Q791 01...