Lanner LEC-6040, Руководство пользователя

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Chapter 4:
Hardware Setup
Preparing the Hardware Installation
WARNING:
To reduce the risk of personal injury, electric
shock, or damage to the equipment, please
make sure the device is totally powered off
and without any power source connected.
It is strongly recommended to wear ESD
proof gloves to conduct the following steps.
Turn the device around (facing the rear panel) and 1.
then turn it upside down.
Remove the screws circled in the image below; one at
2.
the rear and two at each side of the chassis.
3. Gently lift the compartment open.
Installing the System Memory
The motherboard supports DDR3L memory at1333/1600
MHz, up to 2GB, low-voltage, unbuffered and non-ECC.
Please make sure the DDR3L SO-DIMM module in use
meet the specifications.
Remove the SO-DIMM socket heat sink by removing 1.
the 2 screws circled in the image below.
2. Align the DIMM module to the socket, as well as the
notches, and gently pull the retention clips open, to a
slight 15 degree.
3. Once the DIMM is fully inserted, use the retention clip
to secure it.