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SSD50NBT

Hardware Integration Guide

Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Pin # Name

Type

Voltage
Reference

Description

If Not
Used

N/C

CLK_32K

VDDIO

External 32.768KHz input for BT chip.
It is must for BT chip to get deep sleep
mode.

Must be
used

BT_VDD

Power

BT core power supply input 3.3V

3.3V

GND

Ground

GND

BT_UART_RXD

I, PU

VDDIO

Bluetooth UART Serial Input

N/C

BT_UART_TXD

O, PU

VDDIO

Bluetooth UART Serial Output

N/C

BT_UART_CTS

I, PU

VDDIO

Clear-to-send signal for the Bluetooth
UART interface, active low.

N/C

BT_UART_RTS

O, PU

VDDIO

Request-to-send signal for the Bluetooth
UART interface, active low.

N/C

BT_WAKEUP_HOST O

VDDIO

When BT wakes up from its deep sleep
state, it sends an H pulse signal out to
Host. Normally, it is Low state.

Note:

The current software does not

support it.

N/C

GND

Ground

GND

VDDIO

Power

1.8 or 3.3V I/O power configuration.
This is the reference voltage for all I/O
signalling pins; it accepts 1.8V or 3.3V
from the host.

1.8V

3.3V

GND

Ground

GND

SDIO_CLK

VDDIO

SDIO Clock

N/C

GND

Ground

GND

SDIO_DATA_0

I/O

SDIO_IOVDD

SDIO Data 0, internal 10K pulled-up.

N/C

SDIO_DATA_1

I/O

SDIO_IOVDD

SDIO Data 1, internal 10K pulled-up.

N/C

SDIO_DATA_2

I/O

SDIO_IOVDD

SDIO Data 2.

# See Boot strap configuration.

SDIO_DATA_3

I/O

SDIO_IOVDD

SDIO Data 3, internal 10K pulled-up.

N/C

SD_CMD

I/O

SDIO_IOVDD

SDIO Command signal,

# See Boot strap configuration.

SDIO_IOVDD

Power

WLAN Host bust SDIO I/O power
configuration either 1.8V or 3.3V

1.8V

3.3V

AVDD_12

Power

WLAN internal analogy 1.2V input fed
from switching regulator or external 1.2V
DC supply

1.2V

DVDD_12

Power

WLAN internal analogy 1.2V input fed
from switching regulator or external 1.2V
DC supply

1.2V

Содержание SSD50NBT

Страница 1: ...A User Guide SSD50NBT Version 1 0 ...

Страница 2: ... Center http ews support lairdtech com www lairdtech com bluetooth 2 Copyright 2015 Laird All Rights Reserved Americas 1 800 492 2320 Europe 44 1628 858 940 Hong Kong 852 2923 0610 REVISION HISTORY Version Date Notes Approver 1 0 22 Feb 2016 Preliminary Release Connie Lin ...

Страница 3: ...tics 19 Bluetooth Radio Characteristics 21 SDIO Timing Requirements 22 Pin Definitions 24 Boot Straps Options for Wi Fi Interface 27 Mechanical Specifications 28 RF Layout Design Guidelines 29 Recommended Storage Handling Baking and Reflow Profile 30 Required Storage Conditions 30 Baking Conditions 31 Surface Mount Conditions 31 Soldering 31 Cautions When Removing the SIP from the Platform for RMA...

Страница 4: ...nsmit receive RF paths including baluns coexistence band pass filter diplexer switches power amplifier low noise amplifier and reference crystal oscillator Enhanced WLAN BT Coexistence Algorithms Enhanced important use cases including PCM I2S digital audio interface BT stereo audio A2DP BT data transfer profiles such as OPP and FTP BT2 1 EDR BT LE Flexible radio architecture ensures simple customi...

Страница 5: ...ustomization Advanced Bluetooth High speed UART port up to 4 Mbps HFP v1 6 wide band speech supported on chip On chip encoding of SBC and aptX codecs for A2DP music streaming PCM I2S digital audio interface Support for IEEE 802 11 coexistence The flexible RAM ROM based architecture enables custom or future profiles to be easily added SPECIFICATIONS Table 2 Specifications Feature Description Physic...

Страница 6: ...standby 14 dBm MCS7 Transmit 720 mA Receive 140 mA Standby 130 mA Bluetooth with Wi Fi in standby Transmit TBD mA Receive TBD mA Standby 130 mA Operating Temperature 30 to 85 C 22 to 185 F Operating Humidity 10 to 90 non condensing Storage Temperature 40 to 85 C 40 to 185 F Storage Humidity 10 to 90 non condensing Maximum Electrostatic Discharge Conductive 4KV Air coupled 8KV Size 16 mm length x 1...

Страница 7: ...ps Modulation BPSK 1 6 9 6 5 7 2 13 and 14 4 Mbps QPSK 2 12 18 13 14 4 19 5 21 7 26 28 9 39 43 3 Mbps CCK 5 5 and 11 Mbps 16 QAM 24 36 26 29 9 39 43 3 52 57 8 78 86 7 Mbps 64 QAM 48 54 52 57 8 58 5 65 72 2 104 0 115 6 117 0 130 0 144 4 Mbps 802 11n Spatial Streams 2 2x2 MIMO Bluetooth Data Rates Supported 1 2 3 Mbps Bluetooth Modulation GFSK 1 Mbps Pi 4 DQPSK 2 Mbps 8 DPSK 3 Mbps Regulatory Domain...

Страница 8: ...140 KC 5 15 GHz to 5 35 GHz Ch 36 40 44 48 52 56 60 64 5 47 GHz to 5 725 GHz Ch 100 104 108 112 116 120 124 5 725 GHz to 5 825 GHz Ch 149 153 157 161 5 GHz Operating Channels Wi Fi ETSI 19 non overlapping FCC 24 non overlapping MIC Japan 19 non overlapping KC 19 non overlapping Transmit Power Note Transmit power on each channels varies according to individual country regulations All values for low...

Страница 9: ...CS0 Mbps MCS7 Mbps 93 dBm 72 dBm Bluetooth 1 Mbps 84 dBm 1DH1 3 Mbps 76 dBm 3DH5 BLE 87 dBm Operating Systems Supported Windows Mobile 5 0 6 0 6 1 6 5 Windows Embedded Compact CE 5 0 6 0 7 0 2013 Windows 7 8 8 1 Linux 2 6 x 3 x x 4 0 x kernel Android 4 1 2 Jellybean and forward Security Standards Wireless Equivalent Privacy WEP Wi Fi Protected Access WPA IEEE 802 11i WPA2 Encryption Wireless Equiv...

Страница 10: ...ersion 4 Bluetooth SIG Qualification Warranty Five Year Limited Lifetime All specifications are subject to change without notice WLAN FUNCTIONAL DESCRIPTION Overview The SSD50NBT WLAN block is based on the Qualcomm Atheros AR6004 802 11a b g n chipset It is optimized for low power embedded applications and is configured to operate in dual band two stream 2x2 MIMO mode Its functionality includes Im...

Страница 11: ...ET event the SSD50NBT enters the HOST_OFF state and awaits communication from the host From that point the typical COLD_RESET sequence is shown below When the host is ready to use the radio it initiates communication via the SDIO The radio enters the WAKEUP state and then the ON state Embedded software configures the radio functions and interfaces When the radio is ready to receive commands from t...

Страница 12: ... The crystal or oscillator is disabled Any wakeup events force a transition from this state to the WAKEUP state All internal states are maintained WAKEUP The system transitions from sleep states to ON The high frequency clock is gated off as the crystal or oscillator is brought up and the PLL is enabled WAKEUP duration is programmable ON The high speed clock is operational and sent to each block e...

Страница 13: ...ate The BT section sharing clock from wifi chip It will not able to get into deep sleep mode without 32KHz present at pin 24 Without get into deep sleep mode it will consume 3 3mA at VDD_BT supply In order to have BT get into deep sleep mode a 32 768KHz slow clock is must on pin 24 When 32 768KHz present on pin 24 BT chip can go into deep sleep mode with 0 08mA current consume on VDD_BT supply Int...

Страница 14: ...ree of the first four slots following PCM_SYNC The PCM configuration options are enabled by setting SKEY_PCM_CONFIG32 CPU and Memory The CSR8811 uses a 16 bit RISC MCU for low power consumption and efficient use of memory The MCU interrupt controller and event timer run the Bluetooth software stack and control the Bluetooth radio and host interfaces 56 KB of on chip RAM is provided to support the ...

Страница 15: ...e device can occur Functional operation under these conditions or at any other condition beyond those indicated in the operational sections of this document is not recommended Note Maximum rating for signals follows the supply domain of the signals Table 4 Absolute Maximum Ratings Symbol Domain Parameter Max Rating Unit SDIO_IOVDD WLAN host SDIO interface I O supply 0 3 to 4 0 V VDDIO Wi Fi and BT...

Страница 16: ...eakage Current Without Pull up or Pull down 0V VIN VDD 0V VOUT VDD 0 3 nA With Pull up 0 V VIN VDD 0V VOUT VDD 16 48 µA With Pull down 0V VIN VDD 0V VOUT VDD 14 47 µA VOH High Level Output Voltage IOH 4mA 0 9 x VDD V IOH 12mA 0 9 x VDD V VOL Low Level Output Voltage IOH 4mA 0 1 x VDD V IOH 12mA 0 1 x VDD V Table 7 General DC Electrical Characteristics For 1 8V I O Operation Symbol Parameter Condit...

Страница 17: ...utions Support Center http ews support lairdtech com www lairdtech com bluetooth 17 Copyright 2015 Laird All Rights Reserved Americas 1 800 492 2320 Europe 44 1628 858 940 Hong Kong 852 2923 0610 Figure 2 Power On Off Timing Figure 3 Wi Fi and BT reset Timing ...

Страница 18: ...µsec Tg Time of BT_PWD_L assertion during reset or power down period Both 3 3V VDD33 BT_VDD VDD_FEM VDD_USB and VDDIO SDIO_IOVDD should keep ON 5 msec Important SSD50NBT requires SDIO interface lines SD_CMD SD_D1 and SD_D2 to be high prior to negation of WLAN_PWD_L Designs should drive these lines high or if necessary add external pull ups to insure proper SDIO configuration on WLAN boot up Failur...

Страница 19: ...ge 5 15 5 825 GHz Srf Sensitivity OFDM 6 Mbps See Note5 93 dBm OFDM 54 Mbps 75 HT20 MCS0 93 HT20 MCS7 72 HT40 MCS0 87 HT40 MCS7 67 Radj Adjacent channel rejection OFDM 6 Mbps See Note6 22 dB OFDM 54 Mbps 9 HT20 MCS0 20 HT20 MCS7 19 5 Performance data are measured under dual chain operation 6 Performance data are measured under dual chain operation WLAN Transmitter Characteristics Table 11 WLAN Tra...

Страница 20: ...p Max Unit Ftx Transmit output frequency range 5 15 5 925 GHz Pout Output power See Note3 11a mask compliant 6Mbps 18 dBm 11a EVM compliant 54Mbps 15 11n HT20 mask compliant MCS0 18 11n HT20 EVM compliant MCS7 14 11n HT20 EVM compliant MCS15 14 11n HT40 mask compliant MCS0 15 11n HT40 EVM compliant MCS7 12 11n HT40 EVM compliant MCS15 12 ATx Transmit power accuracy at 18dBm 2 0 dB Freq Mode Rate M...

Страница 21: ...ure at 25 C 3 3V Test Parameter Min Typ Max BT Spec Unit Maximum RF Output Power 2 6 6 to 10 dBm Frequency Range 2 4 2 4835 f GHz 20 dB Bandwidth 925 KHz Adjacent Channel TX Power F F0 2 MHz 36 20 dBm Adjacent Channel TX Power F F0 3 MHz 42 40 dBm Δf a g Ma i u Modulatio 140 165 175 Δf a g KHz Δf a Mi i u Modulatio 135 KHz Δf a g Δf a g 0 9 Initial Carrier Frequency 5 75 KHz Drift Rate 5 KHz 50 µs...

Страница 22: ...ferer Ratio C I Co Channel 11 11 Adjacent Channel 1 MHz 4 2 0 0 dB Second Adjacent Channel 2 MHz 35 28 30 30 dB Third Adjacent Channel 3 MHz 42 40 40 dB Maximum Level of Intermodulation Interferers 39 30 39 dBm Table 16 Enhanced Data Rate Receiver Performance 3 3V Test Parameter Min Typ Max Bluetooth Specification Unit Sensitivity BER 0 01 8 DPSK 76 71 70 dBm Maximum Input BER 0 1 π 4 DQPSK 20 20 ...

Страница 23: ...4 SDIO Default Mode Timing Note Timing is based on CL 40 pF load on CMD and Data Table 17 SDIO Timing Requirements Symbol Parameter Min Typ Max Unit fPP Frequency Data Transfer mode 0 50 MHz tWL Clock low time 7 ns tWH Clock high time 7 ns tTLH Clock rise time 10 ns tTHL Clock low time 10 ns Inputs CMD DAT referenced to CLK tISU Input setup time 6 ns tIH Input hold time 2 ns Outputs CMD DAT refere...

Страница 24: ...WLAN antenna port Chain 1 50 Ωload 12 GND Ground GND 13 XPABIAS20 O VDDIO Control signal for external 2GHz power amplifier Chain 0 N C 14 BT_PCM_SYNC I O PD VDDIO PCM interface synchronization control input for slave output for master weak internal pull down High on reset low after reset N C 15 BT_PCM_BCLK I O PD VDDIO PCM interface bit clock input for slave output for master weak internal pull do...

Страница 25: ...from its deep sleep state it sends an H pulse signal out to Host Normally it is Low state Note The current software does not support it N C 32 GND Ground GND 33 VDDIO Power 1 8 or 3 3V I O power configuration This is the reference voltage for all I O signalling pins it accepts 1 8V or 3 3V from the host 1 8V or 3 3V 34 GND Ground GND 35 SDIO_CLK I VDDIO SDIO Clock N C 36 GND Ground GND 37 SDIO_DAT...

Страница 26: ...0 Strobe line for HSIC mode N C 50 GND Ground GND 51 WLAN_PWD_L I PD SDIO_IOVDD WLAN Power down active low external 10K pull up is required 0 power down 1 WLAN awake Negation samples boot strap pin for SDIO interface mode 10K PU 52 WLAN_TDO SDIO_IOVDD Pull High for SDIO Pull Low for USB See Boot strap configuration 53 AR6004_GPIO38 I O VDDIO Reserved for LTE coexistence Reserved for WiFi LED indic...

Страница 27: ... PMU output pin that generates 1 2V to provide to AVDD12 pin 43 DVDD12 pin 44 and AVDD12_USB pin 45 When WLAN is communicating via the USB bus an external 1 2 V maximum rating 400 mA is needed for to AVDD12 pin 43 DVDD12 pin 44 and AVDD12_USB pin 45 This is due to insufficient power from internal PMU No matter WLAN is running at SDIO or USB bus a 10uF 6 3V low ESR capacitor is always needed direct...

Страница 28: ...2923 0610 Figure 5 Setting when using USB interface Figure 6 Setting when using SDIO interface MECHANICAL SPECIFICATIONS Module dimensions of SSD50NBT are 15 x 15 x 2 5 mm Detail drawings are shown in Figure 7 Figure 7 Module dimension of SSD50NBT Note The Wi Fi MAC address is located on the product label The BT MAC address is always be numerically subsequent to the Wi Fi MAC address Therefore the...

Страница 29: ... and thermal dissipation Please double the ground via number when using laser via on HID process More ground via and using 1 oz copper is recommended in our design to get better thermal dissipation Note Whe solde i g the ste il thi k ess should e RF LAYOUT DESIGN GUIDELINES The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your device Do n...

Страница 30: ...o get maximum throughput when operate at MIMO 2x2 two antennas with at least 25 dB isolation is recommended To avoid negatively impacting TX power and receiver sensitivity do no cover the antennas with metallic objects or components RECOMMENDED STORAGE HANDLING BAKING AND REFLOW PROFILE Required Storage Conditions Prior to Opening the Dry Packing The following are required storage conditions prior...

Страница 31: ...s or less Baking Conditions Baking conditions and processes for the SSD50NBT follow the J STD 033 standard which includes the following The calculated shelf life in a sealed bag is 12 months at 40 and 90 relative humidity Once the packaging is opened the SiP must be mounted according to MSL3 Moisture Sensitivity Level 3 within 168 hours at 30 and 60 relative humidity If the SiP is not mounted with...

Страница 32: ... 852 2923 0610 Figure 9 Temperature Profile Cautions When Removing the SIP from the Platform for RMA Bake the platform before remove the SIP from the platform Reference baking conditions Remove the SIP by using a hot air gun This process should be carried out by a skilled technician Suggestion conditions One side component platform Set the hot plate at 280 C Put the platform on the hot plate for 8...

Страница 33: ... On the bottom side use a pre heated nozzle temperature setting of 200 250 C at a suitable distance from the platform PCB On the top side apply a remove nozzle temperature setting of 330 C Heat the SIP until it can be removed from platform PCB Remove the residue solder under the bottom side of SIP Not accepted for RMA Accepted for RMA analysis SIP with residue solder on the bottom SIP without resi...

Страница 34: ...4 PCB Dipole IPEX MHF 2 dBi 2 4 2 5 GHz 3 9 dBi 5 15 5 35 GHz 4 dBi 5 6 GHz Laird MAF95310 Mini Nano Blade Flex PCB Dipole IPEX MHF 2 79 dBi 2 4 GHz 3 38 dBi 5 GHz Laird NanoBlue IP04 PCB Dipole IPEX MHF 2 dBi 2 4 GHz only Ethertronics WLAN_1000146 Isolated Magnetic Dipole IPEX MHF 2 5 dBi 2 390 2 490 GHz 3 5 dBi 4 900 5 100 5 150 5 350 5 70 5 900 GHz FCC AND IC REGULATORY Model US FCC CANADA IC S...

Страница 35: ...ent and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help FCC Caution Any changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate this equipment This device complies with Part 15 of the FCC Rules...

Страница 36: ...ding how to install or e o e this RF odule i the use s a ual of the e d p odu t hi h i teg ates this odule The end user manual shall include all required regulatory information warning as show in this manual Industry Canada Industry Canada Statement This device complies with Industry Canada s license exempt RSSs Operation is subject to the following two conditions This device may not cause interfe...

Страница 37: ...ed for devices in the band 5725 5850 MHz shall be such that the equipment still complies with the EIRP limits specified for point to point and non point to point operation as appropriate and Operations in the 5 25 5 35GHz band are restricted to indoor usage only Avertissement i les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation à l intérieur ...

Страница 38: ...rations or co location with another transmitter then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product In these circumstances the OEM integrator will be responsible for re evaluating the end product including the transmitter and obtaining a separate Canada authorization Note Importante Dans le cas où ces conditions ne peuvent être satisfaites ...

Страница 39: ... 2 79 dBi 2 4 GHz 3 38 dBi 5 GHz Laird NanoBlue IP04 PCB Dipole IPEX MHF 2 dBi 2 4 GHz only Ethertronics WLAN_1000146 Isolated Magnetic Dipole IPEX MHF 2 5 dBi 2 390 2 490 GHz 3 5 dBi 4 900 5 100 5 150 5 350 5 70 5 900 GHz The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their comple...

Страница 40: ...cturer declares that this type of equipment is in compliance with the essential requirements and other relevant provisions of Directive 1999 5 EC Español Spanish Por medio de la presente nombre del fabricante declara que el clase de equipo cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999 5 CE Ε ην ή Greek Μ ΝΣΗΝΝΠΑΡΟΤ Α name of man...

Страница 41: ...com os requisitos essenciais e outras disposições da Directiva 1999 5 CE Slovensko Slovenian Ime proizvajalca izjavlja da je ta tip opreme v skladu z bistvenimi zahtevami in ostalimi relevantnimiΝdoločiliΝdirektiveΝ1999 5 ES Slovensky Slovak Menovýrobcu týmtovyhlasuje Νže typzariadenia spĺňazákladnépožiadavkyΝaΝ všetkypríslušnéustanoveniaSmerniceΝ1999 5 ES Suomi Finnish Valmistaja manufacturer vak...

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