Laird BT740-SA, Руководство по интеграции оборудования

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Enhanced Class 1 Bluetooth v2.1 Module
Hardware Integration Guide
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
4 CONN-HIG-BT740
1 O
VERVIEW AND
K
EY
F
EATURES
Every BT740 series Bluetooth ® module from Laird is designed to add robust, long-range Bluetooth data
connectivity to any device. Based on the market-leading Cambridge Silicon Radio (CSR) BC04 chipset, BT740
modules provide exceptionally low power consumption with outstanding Class 1 range via 18 dBm of
transmit power. The modules support the latest Bluetooth Version 2.1 specification, including Secure Simple
Pairing (SSP), which improves security and enhances the ease of use for end customers. A broad range of
Bluetooth profiles such as Serial Port Profile (SPP) and other vital features make BT740 modules superior to
other Bluetooth modules.
With a compact footprint of 15.29 x 28.71 mm, the modules deliver maximum range with a minimum size.
To ease integration, the modules are designed to support a separate power supply for I/O. Another
integration advantage is the inclusion of a complete Bluetooth protocol stack with support for multi-point
connections and numerous Bluetooth profiles, including SPP, Human Interface Device (HID) profile, and
Health Device Profile (HDP). BT740 modules fully qualify as a Bluetooth End Products, enabling designers to
integrate the modules in devices without the need for further Bluetooth qualification.
An integrated AT command processor interfaces to the host system over a serial port using an extensive
range of AT commands. The AT command set abstracts the Bluetooth protocol from the host application,
saving many months of programming and integration time. It provides extremely short integration times for
data-oriented Bluetooth applications.
Included firmware provides programming support for multi-point applications that use up to seven
simultaneous data connections to and from the robust BT740 module. A low-cost developer’s kit makes it
easy for an OEM to integrate the module and guarantees the fastest route to prototype and then mass
production.
Features & Benefits
Application Areas

Bluetooth v2.1 + EDR

External or internal antennas

Comprehensive AT interface for simple
programming

Alternate packet based interface for complex
programming and up to seven simultaneous
connections

Bluetooth EPL

Compact footprint

Class 1 output – 18 dBm

UART interface with GPIO and ADC lines

Industrial temperature range

Field proven firmware used on BTM44x series
of modules

Medical devices

ePOS terminals

Automotive diagnostic equipment

Barcode scanners

Industrial cable replacement
Bluetooth® Profiles Supported

Serial Port Profile (SPP)

Human Interface Device (HID) profile host
and device supported

Health Device Profile (HDP): Agent
supported

IEEE Device Specialization
11073-10415 (Weight Scale)

IEEE Device Specialization
11073 - 10408 (Thermometer)

IEEE Device Specialization
11073 – 10417 (Glucose)