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Smart Technology. Delivered.

Enhanced Class 1
Bluetooth v2.1 Module

ARDWARE

NTEGRATION

UIDE

ERSION

1.3

Part # BT740-SA, BT740-SC

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

Содержание BT740-SA

Страница 1: ...Delivered Enhanced Class 1 Bluetooth v2 1 Module HARDWARE INTEGRATION GUIDE VERSION 1 3 Part BT740 SA BT740 SC Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth ...

Страница 2: ...2923 0610 www lairdtech com bluetooth 2 CONN HIG BT740 Revision History Revision Revision Date Description 1 0 30 July 2013 Initial Release 1 1 30 Sept 2013 Removed yellow highlights 1 2 19 Dec 2013 Fixed typo 1 3 06 Feb 2014 Updated Bluetooth SIG Qualification section Approved By Jonathan Kaye Jonathan Kaye Jonathan Kaye Jonathan Kaye ...

Страница 3: ...oth 3 CONN HIG BT740 Contents 1 Overview and Key Features 4 2 Specifications 5 3 Hardware Specifications 7 4 I O Characteristics 12 5 Functional Description 13 6 Hardware Integration Suggestions 15 7 Mechanical Details 18 8 Surface Mount Modules 21 9 FCC Regulatory Statements 23 10 EU Declarations of Conformity 27 11 Bluetooth SIG Approvals 29 12 Ordering Information 30 ...

Страница 4: ...egrate the modules in devices without the need for further Bluetooth qualification An integrated AT command processor interfaces to the host system over a serial port using an extensive range of AT commands The AT command set abstracts the Bluetooth protocol from the host application saving many months of programming and integration time It provides extremely short integration times for data orien...

Страница 5: ... antenna connector Receive Sensitivity Better than 87 dBm at 25 C Range 1000m Line of Sight Data Rates Up to 1 0 Mbps over the air UART Data Transfer Rate Circa 350 kbps Host Interface UART One UART TX RX DCD RI DTR DSR CTS RTS1 Default 9600 n 8 1 From 1 200 to 921 600 bps GPIO 8 configurable lines ADC Two ADC channels 8 bit resolution PCM Not Supported in Firmware One PCM interface Profiles SPP S...

Страница 6: ...ransfer 6 mA Connected mode max data transfer 35 mA Sniff mode 1 8 mA Antenna Options Internal Multilayer ceramic BT740 SA External Connection via u FL BT740 SC Physical Connections Surface Mount Pads 1 2mm pitch Dimensions 15 29 mm x 28 71 mm x 2 5 mm Weight 1 5 g Environmental Operating 40 C to 85 C Storage 40 C to 85 C Miscellaneous Lead Free Lead free and RoHS compliant Warranty 5 Year Limited...

Страница 7: ...uide Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth 7 CONN HIG BT740 3 HARDWARE SPECIFICATIONS 3 1 Hardware Specifications Figure 3 1 Functional Block Diagram Figure 3 2 BT740 Sx module pin out Top View ...

Страница 8: ...UART_RX Receive data I P See Note 7 23 UART_TX Transmit data O P 24 UART_RTS Request to Send O P 25 UART_CTS Clear to Send I P See Note 7 26 NC Reserved USB_D Not used for AT module variants 27 NC Reserved USB_D Not used for AT module variants 28 UART_RI Ring Input or Output 29 GPIO_3 UART_DTR I O for host UART_DTR 30 GPIO_5 I O for host 31 GPIO_4 I O for host 32 SPI_CSB SPI bus chip select I P Se...

Страница 9: ...l downs UART_RX UART_TX UART_CTS UART_RTS UART_RI UART_DCD and UART_DSR are 3 3 V level logic For example when RX and TX are idle they sit at 3 3 V Conversely for handshaking pins CTS RTS RI DCD and DSR a 0 V is treated as an assertion Pin 28 UART_RI is active low It is normally 3 3 V When a remote device initiates a connection this pin goes low This means that when this pin is converted to RS232 ...

Страница 10: ...mments VCC_IN 11 I 3 0 V to 5 0 V Typ 3 5 V Ityp 115 mA GND 1 12 15 20 Four 4 ground terminals to be attached in parallel VCC_3V3_monitor 13 O 3 3 V typical For monitoring only No current source Note VCC_3V3_monitor refers to internal voltage generated by the LDO inside the module which is typically 3 3 V So to achieve 3 3 V for VCC_3V3_monitor at Max Tx Power requires VCC_IN of 3 5 V IO voltage l...

Страница 11: ...reprogram Flash in Laird production SPI_MISO 33 O SPI_CSB 32 I SPI_CLK 6 I 3 3 2 5 PCM Interface Signal Name Pin No I O Comments PCM_CLK 7 I or O These pins are NO CONNECT as they are not supported in the Firmware PCM_IN 9 I PCM_SYNC 8 I or O PCM_OUT 10 O 3 3 2 6 General Purpose I O and ADC Signal Name Pin No I O Signal level Comments GPIO_3 9 3 4 16 17 18 19 29 30 31 I or O See Recommended Operat...

Страница 12: ...electronics the power requirements increase linearly with increasing clocking frequencies Because of this higher baud rates result in a higher current drain The significant operating modes are Idle Waiting for a connection Inquiring Initiating a connection Sniff Connected With connected mode it is also relevant to differentiate between no data being transferred and when data is being transferred a...

Страница 13: ...inal 0 V and 3 3 V and are inverted with respect to the signalling on an RS232 cable The interface is programmable over a variety of bitrates no even or odd parity stop bit and hardware flow control The default condition on power up is pre assigned in the external flash UART_RTS and UART_CTS implement two way hardware flow control UART_RTS is an output and is active low UART_CTS is an input and is...

Страница 14: ... the hardware or firmware associated with this port so the terminals should not permanently connect in a PC application 5 3 PCM Interface PCM is not supported in Firmware PCM interface PCM_OUT PCM_IN PCM_CLK and PCM_SYNC exists in HW only 5 4 General Purpose I O and ADC 5 4 1 GPIO Seven lines of programmable bi directional input outputs I O are provided that can be accessed either via the UART por...

Страница 15: ... 3 3V see Notes Electrical Specifications Ensure input voltage levels into GPIO pins are at 3 3V voltage levels Ensure ADC pin maximum input voltage 1 8 V for damage is not violated UART Required Add connector to allow UART to be interfaced to PC via UART RS232 or UART USB UART_RX and UART_CTS Add a 10 k pull up to the host PCB on the UART_RX otherwise the module remains in deep sleep if not drive...

Страница 16: ...of the host PCB Keep all mounting hardware and metal clear of the area to allow proper antenna radiation For best antenna performance place the BT740 SA module on the edge of the host PCB preferably in the corner with the antenna facing the corner An example shown in Figure 6 1 A different host PCB thickness dielectric will have small effect on antenna the BT740 carrier development board used for ...

Страница 17: ...which means some testing by customer is required in their host application Anything metal closer than 20 mm starts to significantly degrade performance S11 gain radiation efficiency It is best that the customer tests the range with a mock up or actual prototype of the product to assess effects of enclosure height and material whether metal or plastic Figure 6 3 Recommended BT740 SA placement on ho...

Страница 18: ... www lairdtech com bluetooth 18 CONN HIG BT740 Note 1 Integral RF co axial cable with UFL connector Antenna manufacturer Laird contact information Email wireless support lairdtech com 7 MECHANICAL DETAILS 7 1 BT740 SC Mechanical Details Figure 7 1 BT740 SC mechanical details 7 2 BT740 SA Mechanical Details Figure 7 2 BT740 SA mechanical details ...

Страница 19: ...ule Hardware Integration Guide Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth 19 CONN HIG BT740 7 3 BT740 Pad Definitions Mechanical Drawing Figure 7 3 BT7xx Mechanical Drawing ...

Страница 20: ...s of proximity detuning the antenna and to help antenna radiate properly Refer to section 6 3 2 for more information 2 For BT740 SA with on board chip antenna best antenna performance the module BT740 SA must be placed on the edge of the host PCB preferably in the corner with the antenna facing the corner see Figure 6 1 The module is placed in the corner of host PCB above the keep out area If the ...

Страница 21: ...ional guidance for mounting the module This section is considered a living document and is updated as new information is presented The modules are designed to meet the needs of a number of commercial and industrial applications The modules are designed to be easily manufactured and conform to current automated manufacturing processes 8 2 Shipping Modules ship in Electrostatic Discharge ESD safe tr...

Страница 22: ...tant During reflow modules should not be above 260 and not for more than 30 seconds Figure 8 2 Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 8 1 Table 8 1 Recommended Maximum and Minimum Temperatures Specification Value Unit Temperature Inc Dec Rate max 1 3 C Sec Temperature Decrease rate goal 2 4 C Sec Soak Temp Increase rate goal 5 1 C ...

Страница 23: ...radiated power EIRP is not more than that permitted for successful communication 9 1 Power Exposure Information In general there are two agency classifications for RF radiation exposure in wireless applications mobile and portable Mobile A mobile device is a transmitting device designed in such a way that a separation distance of at least 20 cm is normally maintained between the transmitter s radi...

Страница 24: ...AUSE HARMFUL INTERFERENCE AND 2 THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION CAUTION The OEM should have the device incorporating with the BT740 tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators CAUTION Any changes or modifications not expressly approved by Laird could v...

Страница 25: ...eil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes Pour utilisation de dispositif module L antenne doit être installée de telle sorte qu une distance de 20 cm est respectée entre l antenne et les utilisateurs Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne Tant que les 2 conditions ci dessus sont remplies des essais supplémentaires sur...

Страница 26: ...how in this manual Manuel d information à l utilisateur final L intégrateur OEM doit être conscient de ne pas fournir des informations à l utilisateur final quant à la façon d installer ou de supprimer ce module RF dans le manuel de l utilisateur du produit final qui intègre ce module Le manuel de l utilisateur final doit inclure toutes les informations réglementaires requises et avertissements co...

Страница 27: ...1 489 17 V2 1 1 Emissions EN55022 2006 A1 2000 A2 2006 ClassB Immunity EN61000 4 2 1995 A1 1998 A2 2001 EN61000 4 3 2002 A1 2002 3 2 Means of the efficient use of the radio frequency spectrum EN 300 328 V1 8 1 2012 06 Declaration We Laird Inc declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates...

Страница 28: ...Emissions EN55022 2006 A1 2000 A2 2006 ClassB Immunity EN61000 4 2 1995 A1 1998 A2 2001 EN61000 4 3 2002 A1 2002 3 2 Means of the efficient use of the radio frequency spectrum EN 300 328 V1 8 1 2012 06 Declaration We Laird Inc declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformit...

Страница 29: ... qid 20701 Interface Express subsystem Cambridge Consultants Ltd B017578 https www bluetooth org tpg QLI_viewQDL cfm qid 17578 11 2 Assumptions This procedure assumes that the member is simply combining two subsystems to create a new design without any modification to the existing qualified subsystems This is achieved by using the listing interface on the Bluetooth SIG website Figure 11 1 shows th...

Страница 30: ...ep 1 select Reference a Qualified Design and enter the Declaration IDs of each subsystem used in the End Product design You can then select your pre paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page please note that unless the Declaration ID is pre paid or purchased with a credit card it will not be possible to proceed until the SIG invoice is paid Once all the ...

Страница 31: ...ription BT740 SA Enhanced Class 1 Bluetooth V2 1 Module internal antenna BT740 SC Enhanced Class 1 Bluetooth v2 1 Module uFL for external antenna DVK BT740 SA Development board with BT740 SA module soldered in place DVK BT740 SC Development board with BT740 SC module soldered in place 12 1 General Comments This is a preliminary datasheet Please check with Laird for the latest information before co...

Страница 32: ...hted and all rights are reserved by Laird Inc Laird Inc reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision Copying duplicating selling or otherwise distributing any part of this product or accompanying documentation software without the prior consent of an authorized representative of Laird Inc is strictly prohibited...

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