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ETX-DC®/ Design Considerations
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6 Design Considerations
6.1 Thermal Management
A heat-spreader plate assembly is available from Kontron Embedded Modules GmbH for the ETX®-DC. The heat-
spreader plate on top of this assembly is NOT a heat sink. It works as an ETX®-standard thermal interface to use with a
heat sink or other cooling device.
External cooling must be provided to maintain the heat-spreader plate at proper operating temperatures. Under
worst-case conditions, the cooling mechanism must maintain an ambient air and heat-spreader plate temperature of
60° C or less.
The aluminum slugs and thermal pads on the underside of the heat-spreader assembly implement thermal interfaces
between the heat spreader plate and the major heat-generating components on the ETX®-DC. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling
solution.
The heat dissipated into the plate ranges from 12 watts. Design a cooling solution to dissipate the heat load on a
heat-spreader plate at a minimum of 25 watts to accommodate all ETX® modules.
You can use many thermal-management solutions with the heat-spreader plates, including active and passive
approaches. The optimum cooling solution varies, depending on the ETX® application and environmental conditions.
Please see the ETX® Design Guide for further information on thermal management.