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11
User Guide
COMe-bP5020
INTERCONN
ECTION
Gigabit Ethernet
Up to five Gigabit Ethernet ports:
» One Gigabit Ethernet port through COMe MDI interface
» Up to four Gigabit Ethernet ports through SGMII interface
SATA
Two SATA ports
SRIO
Up to two x4 Serial RapidIO interfaces operating in host or agent configuration, depend-
ing on configuration
PCI Express
Up to two x4 PCI Express interface operating in root complex configuration
If interface is configured for PCI Express, SRIO is not possible
Debug Interface
One debug port
Serial Interface
Up to four serial ports:
» 2x 4-wire UART interfaces (RxD, TxD, RTS, CTS), or
» 4x 2-wire UART interfaces (RxD, TxD)
GPIO
Up to 12 GPIOs
Con
nectors
Onboard Connectors
Two 220-pin connectors for interfacing with a carrier board
One JTAG/COP connector, J3, for debugging
microSD card Socket
Standard microSD socket, J9, accepts microSD and microSDHC cards
Sw
itch
DIP Switch
One DIP switch for board configuration, SW1, consisting of four switches
LEDs
Module Health Monitor
LEDs
LED7: indicates Reset Status
LED9: indicates “Power Good” status
TIME
R
Watchdog Timer
Software-configurable, two-stage Watchdog with programmable timeout ranging from
125 ms to 4096 s in 16 steps
Serves for generating IRQ or hardware reset
System Timer
There are several timers implemented in the CPU. For further information regarding
these timers, refer to the CPU reference manual from Freescale™.
TH
ER
M
A
L
Thermal Monitoring
One onboard temperature sensor for monitoring the board temperature
GENERAL
Power Consumption
Refer to Chapter 4, “Power Considerations” for information related to the power
consumption of the COMe-bP5020.
Temperature Range
Operational: Refer to Chapter 5, “Thermal” for further information
Storage: -40°C to +70°C
Mechanical
COM Express® basic
Dimensions
125 mm x 95 mm
Board Weight
99 grams (without heat spreader)
220 grams (with heat spreader)
Table 1: COMe-bP5020 Main Specif ications (cont’d)
COMe-bP5020
SPECIFICATIONS
