Kontron AM4011, Руководство пользователя

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Thermal Considerations AM4011
Page 6 - 8 ID 1022-1626, Rev. 1.0
P R E L I M I N A R Y
6.2 System Airflow
The AM4011 is equipped with a specifically designed heat sink to ensure the best possible ba-
sis for operational stability and long-term reliability. Coupled together with system chassis,
which provide variable configurations for forced airflow, controlled active thermal energy dissi-
pation is guaranteed.
The physical size, shape, and construction of the heat sink ensures the lowest possible thermal
resistance. In addition, it has been specifically designed to efficiently support forced airflow
concepts as found in modern AMC carriers and MicroTCA systems.
6.2.1 Forced Airflow in MicroTCA Systems
When developing applications using the AM4011, the system integrator must be aware of the
overall system thermal requirements. The MicroTCA systems must satisfy these thermal re-
quirements.
The following figures illustrate the temperature vs. airspeed graphs of a Mid-size and a Full-
size AM4011 mounted in a MicroTCA system designed for Single Modules. The measurements
were made using the Intel® Thermal Analysis Tool (TAT) operating at 75% which corresponds
to 100% CPU usage of both processor cores. These measurements are equivalent to the val-
ues of a maximum user application environment.
Figure 6-3: Temperature vs. Airspeed Graph of a Mid-Size AM4011