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COMe-mSP1 / Product Specification
3.9
Mechanical Specification
3.9.1
Module Dimension
» 55mm x 84mm (±0.2mm)
3.9.2
Height on Top
» Maximum approx. 3.5mm (withouth printed circuit board)
» Height is depending on (optional) CPU cooler / heat spreader
3.9.3
Height on Bottom
» Maximum approx. 3.5mm (without printed circuit board)
3.9.4
Mechanical Drawing
All dimensions are shown in millimeters. Tolerances should be ± 0.25mm [±0.010”], unless otherwise noted. The
tolerances on the module connector locating peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004”]. The
220 pin module connector shall be mounted on the backside of the PCB and is seen “through” the board in this view. The 4
mounting holes shown in the drawing should use 6mm diameter pads and should have 2.7mm plated holes, for use with
2.5mm hardware. The pads should be tied to the PCB ground plane.
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Содержание 34001-1020-11-1
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Страница 17: ...COMe mSP1 Product Specification 3 3 Block Diagram 17...
Страница 64: ...COMe mSP1 BIOS Operation 6 4 2 Module Info Module Component Steppings 64...
Страница 65: ...COMe mSP1 BIOS Operation Module Software Revisions Memory Module Information 65...
Страница 67: ...COMe mSP1 BIOS Operation 6 4 3 Advanced Menu 67...
Страница 87: ...COMe mSP1 BIOS Operation 6 4 5 Boot 87...
Страница 91: ...COMe mSP1 BIOS Operation 6 4 7 Advanced Chipset Settings 91...