KAWA LCT37AD, Руководство по обслуживанию

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Digital Power Amplifier
R2S15102NP
６．
Absolute Maximum Rating(Table.2)
℃
-40
〜
150 Temperature range
Storage temperature
Tstg
℃
℃
℃
/W
W
V
V
Unit
-20
〜
75
150
30
4.2
40
27
Value
Temperature range
Ma
Junction temperature
ximum Temperature
See Fig.3
Ta = 25°C :See Fig.3
HB1
、
HB2 pin voltage
VD1,VD2 pin volta Maximum VD Voltage ge
Condition
Operating ambient
temperature
Thermal Resistance
Power dispassion
Maximum HB Voltage
Parameter
Ta
Tj
θ
ja
Pd
HB max
VD max
Symbol
Fig.3
Thermal De-rating
(on PCB: printed-circuit board ):Size 75mm x 75mm
2.5W
Without External Heat Sink(1)
Double PCB copper planes(t=0.035mm) are
needed and each size is almost 7５mm X 7５mm.
(θｊａ＝３０℃／Ｗ,4layer PCB）
Pd
6.3W
With Infinite Heat Sink
the ideal condition(θ
jc=12
℃
/W)
1.6W
1.0W
Without External Heat Sink(2)
There is no copper plane and
no thermal treatment.
( 1layer PCB)
0
Un
der
De
vel
opm
ent
10.4W
4.2W
Ta
75
℃
150
℃
25
℃
(NOTE)
PCB pattern design for high effective thermal conductivity
(caution)
There are side expositions of
the die pad at corners of the
package.
(The die pad is grounded.)
Thermal Via
PCB
(1)The exposed die pad is directly soldered with the printed-circuit board pattern .
(2)Thermal Via
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