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QS8M

i.

MX 8M Nano Block Diagram

QS8M – i.MX 8M Mini and Nano – Differentiated Features and Ordering Information

QS8M - i.MX 8M Mini

QS8M - i.MX 8M Nano

Primary Arm

®

 Core

4x Cortex

®

-A53 up to 1.6 GHz

2x Cortex

®

-A53 up to 1.4 GHz

Secondary Arm

®

 Core

1x Cortex-M4F up to 400 MHz

1x Cortex-M7 up to 600 MHz

RAM

1 GB

512 MB

ROM

4 GB

GPU

GC328 2D GPU, GCNanoUltra

3D GPU (1x shader, OpenGL ES 2.0)

GC7000UltraLite (2x shader, OpenGL

ES 2.0/3.0/3.1 OpenCL 1.2, Vulkan)

Video Decode

1080p60 VP9 Profile 0, 2 

(10-bit), HEVC/H.265, AVC/H.264

Baseline, Main, High decoder, VP8

None

Video Encode

1080p60 H.264,  VP8

None

Connectivity

2x USB 2.0

1x USB 2.0

Grade / Temperature

Industrial / -25°C to 85°C

Ordering Information

QS8M/MQ/1GS/4GF/E85

QS8M/ND/512S/4GF/E85

Ka-Ro electronics GmbH - Pascalstr. 22, D-52076 Aachen, Germany - Tel.: +49 2408 1402-0 (FAX -10)

www.karo-electronics.de

2

0

2

0

-0

7

-2

3

Содержание QS Series

Страница 1: ...8M Mini 1 6GHz Quad Cortex A53 1GB DDR3L 4GB eMMC 27mm square 2 3mm total height QFN type lead style 1mm pitch 100 pads Evalkit Gb Ethernet 4 port USB MIPI display and camera connectors USB power sup...

Страница 2: ...o 600MHz RAM 512MB 1GB DDR3L ROM 4GB eMMC Grade Industrial Temperature 25 C to 85 C Display support 1x MIPI DSI 4 lane display interface i MX 8M Mini GC328 2D GPU GCNanoUltra 3D GPU 1080p60 Video de e...

Страница 3: ...GC328 2D GPU GCNanoUltra 3D GPU 1x shader OpenGL ES 2 0 GC7000UltraLite 2x shader OpenGL ES 2 0 3 0 3 1 OpenCL 1 2 Vulkan Video Decode 1080p60 VP9 Profile 0 2 10 bit HEVC H 265 AVC H 264 Baseline Mai...

Страница 4: ...the area the more radiation and EMI problems may occur Ka Ro QSCOM modules uses a large ground pad on the bottom side With this a defined ground plane connection is available for all signals In addit...

Страница 5: ...of the component If the via holes used on the application board have a diameter larger than 0 3 mm it is recommended to mask the via holes to prevent solder wicking through the via holes Solders have...

Страница 6: ...ore than a few seconds can occur it is important that a sufficient cooling surface is provided to dissipate the heat The thermal pad at the bottom of the module must be connected to the application bo...

Страница 7: ...QS8M Packaging Ka Ro electronics GmbH Pascalstr 22 D 52076 Aachen Germany Tel 49 2408 1402 0 FAX 10 www karo electronics de...

Страница 8: ...XFS SAI2_TX_SYNC SAI5_TX_DATA1 SAI2_TX_DATA1 UART1_CTS_B GPIO4 24 ETHERNET 19 ENET_RST SAI2_RXC SAI2_RX_BCLK SAI5_TX_BCLK UART1_RX GPIO4 22 20 ENET_CK125 GPIO1_IO00 CCM_ENET_PHY_REF_CLK_R OOT XTALOSC_...

Страница 9: ...SD_CMD SD2_CMD USDHC2_CMD GPIO2 14 41 SD_D3 SD2_DATA3 USDHC2_DATA3 GPIO2 18 42 SD_D2 SD2_DATA2 USDHC2_DATA2 GPIO2 17 USB 43 USBH_VBUS USB2_VBUS i MX8M Nano Not connected 44 USBH_DN USB2_DN i MX8M Nano...

Страница 10: ...VENT1 GPIO1 12 72 LCD_B3 GPIO1_IO13 USB1_OTG_OC PWM2_OUT GPIO1 13 73 LCD_B4 GPIO1_IO14 USB2_OTG_PWR USDHC3_CD_B PWM3_OUT CCM_CLKO1 GPIO1 14 74 LCD_B5 GPIO1_IO15 USB2_OTG_OC USDHC3_WP PWM4_OUT CCM_CLKO...

Страница 11: ...XD UART2_TXD UART2_TX ECSPI3_SS0 GPIO5 25 95 UARTC_RTS UART4_TXD UART4_TX UART2_RTS_B GPIO5 29 NXP Request to Send input signal 96 UARTC_CTS UART4_RXD UART4_RX UART2_CTS_B PCIE1_CLKREQ_B GPIO5 28 NXP...

Страница 12: ...assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained Operation is subject to the condition that this product not cause harmful interfe...

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