USB UNIT
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
1P3A
S3A
B
A
5:TRST
4:TDO
2:TMS
3:TCK
1:TDI
A
GEA10288-
4
5
6:TX
7:RX
6 7
GND
A
B
2
1
3
C454
C455
C456
C457
R457
R456
R455
K448
K447
K446
K445
K444
K443
K442
RST
C498
C497
C496
R454
R453
R452
R451
C426
R450
R449
R448
R447
R446
R445
PbF
R423
R444
L407
C60
5
C604
R432
R43
1
R430
C471
C401
C402
C403
C404
R429
R43
6
Q401
R434
L491
C49
5
C494
C492
C493
C491
IC491
C410
R415
R420
R419
R418
L406
L405
L404
C421
C42
0
C41
9
L403
C41
6
C417
C415
C414
R407
R406
R402
L402
L401
R401
C409
C405
C406
R404
C408
C407
R405
X401
R443
R442
R441
C442
C441
K441
C443
IC441
C424
C423
C422
IC401
MARK
UL
R521
R60
7
BM2
R606
R469
R468
R610
R60
4
R605
R422
K453
L601
K454
IC601
IC47
1
K452
C601
C43
0
C429
C603
C602
CN444
C606
K451
created date:2012-01-17
No.MA520
(No.MA520<Rev.001>)15/18