1-8 (No.MB355)
3.1.2 Removing the top panel
(See Fig.4 to 7)
• Prior to performing the following procedure, remove the side
panel (R)/(L).
(1) From the back of the body, remove the two screws
D
at-
taching the top panel.
(2) From each side of the body, remove the two screws
E
at-
taching the top panel.
(3) From each side of the body, release the two joints
a
of the
front panel assembly and top panel.
(4) Remove the top panel rearward while moving the rear side
of the top panel in the direction of the arrow.
Fig.4
Fig.5
Fig.6
Fig.7
Top panel
Rear panel
Rear cover
D
Top panel
Front panel assembly
E
a
Top panel
Front panel assembly
E
a
Front panel assembly
CN601
Main board
CN402
Amp board
CN202
Содержание FS-GD7
Страница 27: ... M E M O ...
Страница 29: ...2 2 rd board to board board to board board to board board to board V BI1206971V BI12P402341V ...
Страница 30: ...Block diagram 2 3 ...
Страница 31: ...2 42 12 2 ...
Страница 32: ...Standard schematic diagrams Primary section 2 5 ...
Страница 33: ...2 6 ...
Страница 34: ...Main section 2 7 ...
Страница 35: ...2 8 ...
Страница 36: ...Amp section 2 9 ...
Страница 37: ...2 10 ...
Страница 38: ...Micon section 2 11 ...
Страница 39: ...2 12 ...
Страница 40: ...Front section 2 13 ...
Страница 41: ...2 14 ...
Страница 42: ...Video section 2 15 ...
Страница 43: ...2 16 ...
Страница 45: ... Bottom side 2 18 ...
Страница 46: ... Forward side Amp board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade 2 19 ...
Страница 47: ... Reverse side 2 20 ...
Страница 48: ...Trans board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade 2 21 ...
Страница 49: ... M E M O ...