SERVICE MANUAL
COPYRIGHT © 2005 Victor Company of Japan, Limited
No.MB355
2005/5
COMPACT COMPONENT SYSTEM
MB355
2005
5
FS-GD7
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
TABLE OF CONTENTS
1
PRECAUTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
2
SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
3
DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
4
ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
5
TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
Содержание FS-GD7
Страница 27: ... M E M O ...
Страница 29: ...2 2 rd board to board board to board board to board board to board V BI1206971V BI12P402341V ...
Страница 30: ...Block diagram 2 3 ...
Страница 31: ...2 42 12 2 ...
Страница 32: ...Standard schematic diagrams Primary section 2 5 ...
Страница 33: ...2 6 ...
Страница 34: ...Main section 2 7 ...
Страница 35: ...2 8 ...
Страница 36: ...Amp section 2 9 ...
Страница 37: ...2 10 ...
Страница 38: ...Micon section 2 11 ...
Страница 39: ...2 12 ...
Страница 40: ...Front section 2 13 ...
Страница 41: ...2 14 ...
Страница 42: ...Video section 2 15 ...
Страница 43: ...2 16 ...
Страница 45: ... Bottom side 2 18 ...
Страница 46: ... Forward side Amp board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade 2 19 ...
Страница 47: ... Reverse side 2 20 ...
Страница 48: ...Trans board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade 2 21 ...
Страница 49: ... M E M O ...
