1-10 (No.MB455)
3.1.8 Removing the power amplifier ICs
(See Figs.12 to 14)
• Remove the metal cover, rear panel and amplifier board.
(1) From the forward side of the amplifier board, remove the
four screws
G
and screw
H
attaching the power amplifier
ICs to the heat sink. (See Figs.12 and 13.)
(2) From the reverse side of the amplifier board, remove the
three screws
J
attaching the heat sink. (See Fig.14.)
(3) Remove the soldered sections (
d
,
e
,
f
) and remove the
power amplifier ICs from the forward side of the amplifier
board. (See Fig.14.)
Fig.12
Fig.13
Fig.14
Amplifier board
G
Heat sink
Power amplifier IC (AIC01)
Amplifier board
G
H
Heat sink
Power amplifier IC (PIC02)
Power amplifier IC (AIC02)
Amplifier board
J
d
f
e
Содержание CA-HXD7
Страница 22: ...2 2 Main section Standard schematic diagrams ...
Страница 23: ...2 3 Parts are safety assurance parts When replacing those parts make sure to use the specified one Amp section ...
Страница 24: ...2 4 FL Key control section ...
Страница 26: ...2 6 Vide section ...
Страница 28: ...2 8 Main board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade Reverse sde ...
Страница 31: ...2 11 Power board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade ...