SERVICE MANUAL
COPYRIGHT © 2005 Victor Company of Japan, Limited
No.MB366
2005/6
COMPACT COMPONENT SYSYTEM
MB366
2005
6
HX-C6
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
TABLE OF CONTENTS
1
PRECAUTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
2
SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
3
DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
4
ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21
5
TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21
CA-HXC6
SP-HXC6
SP-HXC6
Area suffix
J ---------------------------- U.S.A.
Содержание CA-HXC6
Страница 7: ... No MB366 1 7 Fig 3 Metal cover A A ...
Страница 35: ...3 13 MEMO ...
Страница 41: ...2 2 Block diagram ...
Страница 44: ...2 5 CD section ...
Страница 45: ...2 6 Front section ...
Страница 48: ...2 9 Front board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade ...
Страница 49: ...2 10 CD board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade ...
Страница 50: ... M E M O ...