1
Manual Revision Information
Reversion
Revision History
Date
4.0
Fourth Edition
August 2002
Item Checklist
5
603TCF/603TCFL Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
5
603TCF/603TCFL User’s Manual
Intel
Processor Family
Thermal Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems. Maintaining
the proper thermal environment is key to reliable, long-term system operation. The
overall goal in providing the proper thermal environment is keeping the processor
below its specified maximum case temperature. Heatsinks induce improved processor
heat dissipation through increased surface area and concentrated airflow from attached
fans. In addition, interface materials allow effective transfers of heat from the
processor to the heatsink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by Intel for use with Intel
processors.
Vendor list for heatsink and fan of
Pentium® !!! processor
, please visit
：
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of
Intel®Celeron™ processor
, please visit
：
http://developer.intel.com/design/celeron/components/index.htm
