1
Manual Revision Information
Reversion
Revision History
Date
3.0
Third Edition
May 2002
Item Checklist
5
601TCF Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
5
601TCF User’s Manual
Intel
Processor Family
Thermal Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping the
processor below its specified maximum case temperature. Heatsinks induce improved
processor heat dissipation through increased surface area and concentrated airflow
from attached fans. In addition, interface materials allow effective transfers of heat
from the processor to the heatsink. For optimum heat transfer, Intel recommends the
use of thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by Intel for use with Intel
processors.
Vendor list for heatsink and fan of
Pentium® !!! processor
, please visit
：
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of
Intel®Celeron™ processor
, please visit
：
http://developer.intel.com/design/celeron/components/index.htm
Chapter 1
