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Manual Solder Paste
Dispenser*
Ref. DPM-B
3
4
Clean the pads with the desoldering tool
DS360*.
For this operation JBCs desoldering station* is
needed.
Apply the solder paste amount needed to
solder the new chip component.
The use of JBC´s DPM Manual Solder Paste
Dispenser* is recommended.
Pad Cleaning
Solder Paste Dispensing
*
not included, sold separately
9
Содержание NAU
Страница 1: ...INSTRUCTION MANUAL NAU Nano Control Unit...
Страница 14: ...Notes 14...