International Rectifier SupIRBuck IRDC3863, Руководство пользователя

Страница: 13 / 15

IRDC3863
13
Solder Resist
It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder resist should be pulled
away from the metal lead lands by a minimum of 0.025mm to ensure
NSMD pads.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the copper of
0.05mm to accommodate solder resist misalignment.
Ensure that the solder resist in between the lead lands and the pad land is
≥
0.15mm due to the high aspect ratio of
the solder resist strip separating the lead lands from the pad land.