Intel Xeon E5-2400, Термомеханическое конструкторское руководство, Страница: 10 / 100

Introduction
10 Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Notes:
1. Available at http://www.intel.com. Document numbers are subject to change.
2. Available at http://www.blauer-engel.de/en/index.php
3. Available at https://learn.intel.com/portal/scripts/general/logon.aspx.
4. Contact your local Intel Field Sales Representative.
1.2 Definition of Terms
Table 1-1. Reference Documents
Document Number Notes
European Blue Angel Recycling Standards 2
Intel® Xeon® Processor E5-2400 Product Family Datasheet -
Volume One
327248 1
Platform Environment Control Interface (PECI) Specification 4
Intel® Xeon® Processor E5-2400 Processor Product Family
Mechanical Model
327322 1
Intel® Xeon® Processor E5-2400 Processor Product Family
Thermal Model
327321 1
Manufacturing With Intel Components Using Lead-Free
Technology
3
Platform Digital Thermal Sensor (DTS) Based Thermal
Specifications and Overview
4
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1356-LGA land
package onto the socket contacts.
LGA1356 socket The processor mates with the system board through this surface mount, 1356-contact
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for
Ψ
measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total
Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.