Intel WiFi Link 5100, Руководство по конструкции

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Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 7
Intel
®
5100 MCH Chipset
1.2 Definition of Terms
Figure 1. Thermal Design Process
Table 1. Definition of Terms
Term Definition
FC-BGA
Flip Chip Ball Grid Array. A package type defined by a plastic substrate where
a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls
attached to the substrate opposite the die.
Note: The device arrives at the customer with solder balls attached.
BLT
Bond line thickness. Final settled thickness of the thermal interface material
after installation of heatsink.
ICH9 I/O Controller Hub 9
IHS Integrated Heat Spreader
MCH
Memory controller hub. The chipset component that contains the processor
interface, the memory interface, the PCI Express* interface and the ESI
interface.
T
case_max
Maximum allowed component temperature. This temperature is measured at
the geometric center of the top of the package IHS.
T
case_min
Minimum allowed component temperature. This temperature is measured at
the geometric center of the top of the package IHS.
TDP
Thermal design power. Thermal solutions should be designed to dissipate
this target power level. TDP is not the maximum power that the chipset can
dissipate.
TIM Thermal Interface Material
Ψ
CA
Case-to-ambient thermal characterization parameter. A measure of the
thermal solution thermal performance including TIM using the thermal
design power. Defined as (T
CASE
- T
LA
) / TDP
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of the TIM
thermal performance using the thermal design power. Defined as (T
CASE
-
T
LA
) / TDP
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink
thermal performance using the thermal design power. Defined as (T
CASE
-
T
LA
) / TDP
•
Package Level Thermal Models
•
Thermal Model User’s Guide
Step 1: Thermal Simulation
•
Reference Heatsinks
•
Reference Mounting Hardware
•
Vendor Contacts
Step 2: Heatsink Design
and Selection
Step 3: Thermal Validation
•
Thermal Testing Software
•
Thermal Test Vehicle
•
User Guides