Intel® Server Boards SE7320SP2 and SE7525GP2
Introduction
Revision 4.0
1
1. Introduction
This Technical Product Specification (TPS) provides detail to the architecture and feature set of
the Intel
®
Server Board SE7320SP2 and the Intel
®
Server Board SE7525GP2. Unless otherwise
noted, features discussed in this document apply to both server boards.
The target audience for this document is anyone wishing to obtain more in depth detail of the
server board than what is generally made available in the board’s Users Guide. It is a technical
document meant to assist people with understanding and learning more about the specific
features of the board.
1.1 Chapter
Outline
This document is divided into the following chapters
Chapter 1: Introduction
Chapter 2: Server Board Overview
Chapter 3: Functional Architecture
Chapter 4: System BIOS
Chapter 5: Platform Management
Chapter 6: Error Reporting and Handling
Chapter 7: Connector Definitions and Pin-outs
Chapter 8: General Specifications
Chapter 9: Product Regulatory Compliance
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components which need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation can
not be held responsible, if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
Содержание SE7320SP2 - 800MHZ Ecc Ddr Xeon
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