Intel® Server Board S1200SP Family Technical Product Specification
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11
Environmental Limits Specification
The following table defines the Intel
®
Server Board S1200SP series operating and non-operating
environmental limits. Operation of the Intel
®
Server Board S1200SP at conditions beyond those shown in the
following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions
for extended periods may affect system reliability.
Table 52. Server Board Design Specifications
Operating Temperature
0º C to 55º C 1 (32º F to 131º F)
Non-Operating Temperature
-40º C to 70º C (-40º F to 158º F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
, 170 inches/sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note:
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that
need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel
server building blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses not to use
Intel developed server building blocks to consult vendor datasheets and operating parameters to determine
the amount of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly when used
outside any of its published operating or non-operating limits.
Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock requirement
mentioned above through its own chassis development and system configuration. It is the responsibility of
the system integrator to determine the proper shock level of the board and system if the system integrator
chooses different system configuration or different chassis. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of its published
operating or non-operating limits.
11.1
Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel
®
processor-based systems, the processor must
remain within the defined minimum and maximum case temperature (TCASE) specifications. Thermal
solutions not designed to provide sufficient thermal capability may affect the long-term reliability of the
