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System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could  

  result in a reduction of as much as 1GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration  

  and operating system.

2

 64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64  

  architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and  

  software configurations. See http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL 

PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY  

WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES 

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.
  * Other names and brands may be claimed as the property of others. 

** Supports 95W Thermal Design Power, Intel® Core™2 Quad Processors with 1333 / 1066 MHz System Bus. For information, visit www.intel.com/go/findCPU
Copyright © 2008 Intel Corporation. All rights reserved. 0208/MS/TC/PDF  

319230-001US

Technical Specifications

Processor 

 

Processor Support  

•  Intel® Core™2 Quad** processor in the LGA775

 

  package

 

•  Intel® Core™2 Duo processor in the LGA775

 

  package

 

•  Intel® Pentium® Dual-Core processor in the

 

  LGA775 package

 

•  Intel® Celeron® Dual-Core processor in the

 

  LGA775 package

 

•  Intel® Celeron® 400 Series processor in the

 

  LGA775 package

 

•  Supports Intel® 64 Architecture

2

Chipset 

Intel® G35 Express Chipset 

•  Intel® 82G35 Graphics and Memory Controller

 

  Hub (GMCH)

 

•  Intel® I82801HB ICH8 I/O Controller Hub

 

•  Serial Peripheral Interface (SPI) Flash 

Graphics Memory Controller Hub (GMCH)  

•  Designed to support up to 8 GB

1

 of system 

  memory using DDR2 800 / 667 SDRAM 

 

  memory

 

•  Intel® Fast Memory Access

 

•  Intel® Graphics Media Accelerator X3500 with

 

  Intel® Clear Video Technology

Intel® I/O Controller Hub 

•  Four SATA (3.0 Gb/s) ports

 

•  Intel® PRO 10 / 100 / 1000 network connection

 

•  Ten Hi-Speed USB 2.0 ports (six back panel

 

  ports and an additional four USB ports via two

 

  internal headers)

System BIOS 

•  8 Mb Flash EEPROM with Intel® Platform 

 

  Innovation Framework for EFI Plug and Play, 

 

  IDE drive auto-configure

 

•  Advanced configuration and power interface

 

  V1.0b, DMI 2.0, multilingual support

Intel® Rapid BIOS Boot 

•  Optimized POST for faster access to PC from

 

  power-on

System Memory 

Memory Capacity 

•  Four 240-pin DIMM connectors supporting 

 

  up to four double-sided DIMMs

Memory Types 

•  DDR2 800 / 667 SDRAM memory support

 

•  Non-ECC Memory

Memory Modes

 

•  Dual- or single-channel operation support

Memory Voltage 

•  1.8V

Hardware Management Features 

•  Processor fan speed control

 

•  System chassis fan speed control

 

•  Voltage and temperature sensing

 

•  Fan sensor inputs used to monitor fan activity

 

•  Power management support for ACPI 1.0b

High-Performance Intel® 82566DC Gigabit  

Network Connections

 

•  High quality and reliability with Intel’s 

 

  world-class manufacturing and validation

Expansion Capabilities 

•  One PCI bus add-in card connector

 

•  Two PCI Express* x1 bus add-in card connectors

 

•  One PCI Express* x16 graphics connector

 

•  Ultra ATA 100 / 66 devices

Jumpers and Front-Panel Connectors 

Jumpers 

•  Single configuration jumper design

 

•  Jumper access for BIOS maintenance mode

Front-Panel Connectors 

•  Reset, HDD LED, Power LEDs, power on/off

 

•  Two front-panel Hi-Speed USB 2.0 headers

 

•  One 1394a header

 

•  Front-panel audio header

 

•  One serial header

Mechanical 

Board Style 

•  ATX 2.2-compliant

Board Size 

•  9.6” x 9.6” (24.38 cm x 24.38 cm)

Baseboard Power Requirements 

•  ATX12V

Environment 

Operating Temperature 

•  0° C to +55° C

Storage Temperature 

•  -40° C to +70° C

Regulations and Safety Standards

 

United States and Canada

 

  CSA/UL 60950-1, First Edition 

 

  (Binational Standard)

 

Europe  

  (Low Voltage Directive 2006/95/EC)

 

  EN 60950-1:2006

 

International 

  IEC 60950-1:2001, First Edition

EMC Regulations  

(tested in representative chassis) 

United States 

  FCC 47 CFR Part 15, Subpart B

 

Canada 

  ICES-003 Class B

 

Europe 

 

  (EMC Directive 2004/108/EC)

 

  EN 55022:2006 and EN 55024:1998

 

Australia/New Zealand 

  EN 55022:2006 Class B

 

Japan

 

  VCCI V-3/04.04, V-4/03.04, Class B

 

South Korea

 

  KN-22:2005 and KN-24:2005

 

Taiwan

 

  CNS 13438:2006 Class B

 

International

 

  CISPR 22:2005 +A1:2005 +A2:2006 Class B

Environmental Compliance 

Europe

 

  Europe RoHS (Directive 2002/95/EC)

 

China

 

  China RoHS (MII Order # 39)

Lead-Free:

 The symbol is used to 

identify electrical and electronic 

assemblies and components in which 

the lead (Pb) concentration level in any 

of the raw materials and the end product is not 

greater than 0.1% by weight (1000 ppm). This 

symbol is also used to indicate conformance to 

lead-free requirements and definitions adopted 

under the European Union’s Restriction on Haz

-

ardous Substances (RoHS) directive, 2002/95/EC.

Ordering Information: See the Intel 
Web site at www.intel.com. For the 
most current product information, 
visit developer.intel.com/design/ 
motherbd/

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