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Intel

Core

2 Duo E6400, E4300, and Intel

Pentium

Dual-Core E2160 Processor

October 2007

TDG

Order Number: 315279 - 003US

Intel

Core

2 Duo E6400, E4300, and Intel

Pentium

Dual-Core E2160 Processor

Contents

1.0

Introduction ..............................................................................................................7
1.1

Document Goals and Scope ..................................................................................7
1.1.1

Importance of Thermal Management...........................................................7

1.1.2

Document Goals.......................................................................................7

1.1.3

Document Scope ......................................................................................7

1.2

References .........................................................................................................9

1.3

Definition of Terms ..............................................................................................9

2.0

Processor Thermal/Mechanical Information ............................................................ 11
2.1

Mechanical Requirements ................................................................................... 11
2.1.1

Processor Package.................................................................................. 11

2.1.2

Heatsink Attach ..................................................................................... 12

2.2

Thermal Requirements ....................................................................................... 14
2.2.1

Processor Case Temperature.................................................................... 14

2.2.2

Thermal Profile ...................................................................................... 15

2.2.3

CONTROL

................................................................................................. 16

2.3

Heatsink Design Considerations........................................................................... 17
2.3.1

Heatsink Size......................................................................................... 17

2.3.2

Heatsink Mass........................................................................................ 18

2.3.3

Package IHS Flatness.............................................................................. 18

2.3.4

Thermal Interface Material....................................................................... 18

2.4

System Thermal Solution Considerations .............................................................. 19
2.4.1

Chassis Thermal Design Capabilities.......................................................... 19

2.4.2

Improving Chassis Thermal Performance ................................................... 19

2.4.3

Summary .............................................................................................. 19

2.5

System Integration Considerations ...................................................................... 20

3.0

Thermal Metrology .................................................................................................. 21
3.1

Characterizing Cooling Performance Requirements................................................. 21
3.1.1

Example................................................................................................ 22

3.2

Processor Thermal Solution Performance Assessment............................................. 23

3.3

Local Ambient Temperature Measurement Guidelines ............................................. 23

3.4

Processor Case Temperature Measurement Guidelines............................................ 25

4.0

Thermal Management Logic and Thermal Monitor Feature ....................................... 26
4.1

Processor Power Dissipation................................................................................ 26

4.2

Thermal Monitor Implementation......................................................................... 26
4.2.1

PROCHOT# Signal .................................................................................. 27

4.2.2

Thermal Control Circuit ........................................................................... 27

4.2.3

Thermal Monitor 2 .................................................................................. 28

4.2.4

Operation and Configuration .................................................................... 29

4.2.5

On-Demand Mode .................................................................................. 30

4.2.6

System Considerations............................................................................ 30

4.2.7

Operating System and Application Software Considerations.......................... 31

4.2.8

THERMTRIP# Signal ............................................................................... 31

4.2.9

Cooling System Failure Warning ............................................................... 31

4.2.10 Digital Thermal Sensor............................................................................ 31
4.2.11 Platform Environmental Control Interface (PECI) ........................................ 32

5.0

Intel® Reference Thermal Solution.......................................................................... 33
5.1

Thermal Solution Requirements........................................................................... 33

5.2

PICMG 1.3 Form Factor ...................................................................................... 34

5.3

ATX/BTX form factors ........................................................................................ 36

Содержание Core 2 Duo E4300

Страница 1: ...Order Number 315279 003US Intel CoreTM 2 Duo E6400 E4300 and Intel Pentium Dual Core E2160 Processor Thermal Design Guide October 2007 ...

Страница 2: ... deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Copies of documents which have an order number and are referenced in this document or other Intel literature may be obtained by calling 1 800 548 4725 or by visiting Intel s W...

Страница 3: ...apabilities 19 2 4 2 Improving Chassis Thermal Performance 19 2 4 3 Summary 19 2 5 System Integration Considerations 20 3 0 Thermal Metrology 21 3 1 Characterizing Cooling Performance Requirements 21 3 1 1 Example 22 3 2 Processor Thermal Solution Performance Assessment 23 3 3 Local Ambient Temperature Measurement Guidelines 23 3 4 Processor Case Temperature Measurement Guidelines 25 4 0 Thermal M...

Страница 4: ...rivative PID 39 6 2 Board and System Implementation of Intel QST 41 6 3 Intel QST Configuration and Tuning 43 6 4 Fan Hub Thermistor and Intel QST 43 A LGA775 Socket Heatsink Loading 44 A 1 LGA775 Socket Heatsink Considerations 44 A 2 Metric for Heatsink Preload for Designs Non Compliant with Intel Reference Design 44 A 3 Heatsink Selection Guidelines 49 B Thermal Interface Management 50 B 1 Bond ...

Страница 5: ...hermal Sensor 32 10 Thermal Characterization Parameters for Various Operating Conditions 34 11 PICMG 1 3 Copper Heatsink 35 12 PICMG 1 3 Heatsink Performance 36 13 Intel QST Overview 39 14 PID Controller Fundamentals 40 15 Intel QST Platform Requirements 41 16 Example Acoustic Fan Speed Control Implementation 42 17 Digital Thermal Sensor and Thermistor 43 18 Board Deflection Definition 46 19 Examp...

Страница 6: ... and Intel Pentium Dual Core E2160 Processor TDG October 2007 6 Order Number 315279 003US Revision History Date Revision Description October 2007 003 Updated to include the Intel Pentium Dual Core E2160 processor March 2007 002 Updated to include the Intel E4300 processor September 2006 001 Initial release ...

Страница 7: ...ed by the continued push of technology to increase processor performance levels and packaging density more transistors As operating frequencies increase and packaging size decreases the power density increases while the thermal solution space and airflow typically become more constrained or remains the same within the system The result is an increased importance on system design to ensure that the...

Страница 8: ...processor reference the specific processor datasheet Section 2 0 of this document discusses package thermal mechanical requirements to design a thermal solution for the processor in the context of personal computer applications Section 2 0 discusses the thermal solution considerations and metrology recommendations to validate a processor thermal solution Section 4 0 addresses the benefits of the p...

Страница 9: ... guides 302553 htm Fan Specification for 4 wire PWM Controlled Fans http www formfactors org Performance ATX Desktop System Thermal Design Suggestions http www formfactors org Performance microATX Desktop System Thermal Design Suggestions http www formfactors org Balanced Technology Extended BTX System Design Guide http www formfactors org Table 2 Terms Used Sheet 1 of 2 Term Description TA The me...

Страница 10: ...ower Interface Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface Thermal Monitor A feature on the processor that attempts to keep the processor die temperature within factory specifications TCC Thermal Control Circuit Thermal Monitor u...

Страница 11: ...GA surface mount socket The socket contains 775 contacts arrayed about a cavity in the center of the socket with solder balls for surface mounting to the motherboard The socket is named LGA775 socket A description of the socket can be found in the LGA775 Socket Mechanical Design Guide The package includes an integrated heat spreader IHS that is shown in Figure 1 Refer to the processor datasheet fo...

Страница 12: ...y to ensure thermal performance of the thermal interface material between the heatsink base and the IHS it should not exceed the corresponding specification given in the processor datasheet When a compressive static load is necessary to ensure mechanical performance it should remain in the minimum maximum range specified in the processor datasheet The heatsink mass can also generate additional dyn...

Страница 13: ...between 18 lbf and 70 lbf throughout the life of the product for designs compliant with the Intel reference design assumption 72 mm x 72 mm mounting hole span refer to Figure 20 The minimum load is required to protect against fatigue failure of socket solder joint in temperature cycling It is important to take into account potential load degradation from creep over time when designing the clip and...

Страница 14: ...his package The amount of power that can be dissipated as heat through the processor package substrate and into the socket is usually minimal The thermal limits for the processor are the Thermal Profile and TCONTROL The Thermal Profile defines the maximum case temperature as a function of power being dissipated TCONTROL is a specification used in conjunction with the temperature reported by the on...

Страница 15: ...e Intel Pentium 4 Processor on 90 nm Process in the 775 Land LGA Package Thermal and Mechanical Design Guidelines available on www intel com for details on the RCBFH 3 thermal solution This performance is expressed as the slope on the thermal profile and can be thought of as the thermal resistance of the heatsink attached to the processor ΨCA Refer to Section 3 1 The intercept on the thermal profi...

Страница 16: ...on Intel Quiet System Technology Intel QST The value of TCONTROL is driven by a number of factors One of the most significant of these is the processor idle power As a result a processor with a high TCONTROL will dissipate more power than a part with lower value of TCONTROL when running the same application The value of TCONTROL is calculated such that regardless of the individual processor s TCON...

Страница 17: ...B for more information on TIM and on bond line management between the IHS and the heatsink base The heat transfer conditions on the surface on which heat transfer takes place Convective heat transfer occurs between the airflow and the surface exposed to the flow It is characterized by the local ambient temperature of the air TA and the local air velocity over the surface The higher the air velocit...

Страница 18: ...t of developing and implementing a heatsink attach mechanism that can ensure the system integrity under the mechanical shock and vibration profile targets may become prohibitive 2 3 3 Package IHS Flatness The package IHS flatness for the product is specified in the datasheet and can be used as a baseline to predict heatsink performance during the design phase Intel recommends testing and validatin...

Страница 19: ...it devices For example ducted blowers heat pipes and liquid cooling are all capable of dissipating additional heat Due to their varying attributes each of these solutions may be appropriate for a particular system implementation To develop a reliable cost effective thermal solution thermal characterization and simulation should be carried out at the entire system level accounting for the thermal r...

Страница 20: ...of airflow entering and within the heatsink area Physical volumetric constraints placed by the system 2 5 System Integration Considerations Manufacturing with Intel Components using 775 Land LGA Package and LGA775 Socket documentation provides Best Known Methods for all aspects of LGA775 socket based platforms and systems manufacturing Of particular interest for package and heatsink installation a...

Страница 21: ...imensional phenomenon that can rarely be accurately and easily modeled by a single resistance parameter like Ψ The case to local ambient thermal characterization parameter value ΨCA is used as a measure of the thermal performance of the overall thermal solution that is attached to the processor package It is defined by the following equation and measured in units of C W Equation 1 ΨCA TC TA PD Whe...

Страница 22: ... temperature at the processor TA Since the processor thermal profile applies to all processor frequencies it is important to identify the worst case lowest ΨCA for a targeted chassis characterized by TA to establish a design strategy The following provides an illustration of how one might determine the appropriate performance targets The example power and temperature numbers used here are not rela...

Страница 23: ...ent temperature TA is the temperature of the ambient air surrounding the processor For a passive heatsink TA is defined as the heatsink approach air temperature for an actively cooled heatsink it is the temperature of inlet air to the active cooling fan It is worthwhile to determine the local ambient temperature in the chassis around the processor to understand the effect it may have on the case t...

Страница 24: ...thermocouples should be placed approximately 13 mm to 25 mm 0 5 to 1 0 in away from processor and heatsink as shown in Figure 5 The thermocouples should be placed approximately 51 mm 2 0 in above the baseboard This placement guideline is meant to minimize the effect of localized hot spots from baseboard components Note Testing an active heatsink with a variable speed fan can be done in a thermal c...

Страница 25: ...ents are made the thermocouples must be calibrated and the complete measurement system must be routinely checked against known standards When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air errors could be introduced in the measurements The measurement errors could be caused by poor thermal contact between the junction of the thermoc...

Страница 26: ...icantly reduce processor power consumption An on die thermal management feature called Intel Thermal Monitor is available on the processor It provides a thermal management approach to support the continued increases in processor frequency and performance By using a highly accurate on die temperature sensing circuit and a fast acting Thermal Control Circuit TCC the processor can rapidly initiate th...

Страница 27: ...e VR temperature and activate the TCC when the temperature limit of the VR is reached By asserting PROCHOT pulled low or FORCEPR which activates the TCC the VR can cool down as a result of reduced processor power consumption Bi directional PROCHOT can allow VR thermal designs to target maximum sustained current instead of maximum current Systems should still provide proper cooling for the VR and r...

Страница 28: ...age The first operating point represents the normal operating condition for the processor The second operating point consists of both a lower operating frequency and voltage When the TCC is activated the processor automatically transitions to the new frequency This transition occurs very rapidly on the order of 5 μs During the frequency transition the processor is unable to service any bus request...

Страница 29: ... The Thermal Control Circuit feature can be configured and monitored in a number of ways OEMs are required to enable the Thermal Control Circuit while using various registers and outputs to monitor the processor thermal status The Thermal Control Circuit is enabled by the BIOS setting a bit in an MSR model specific register Enabling the Thermal Control Circuit allows the processor to attempt to ma...

Страница 30: ...f 7 8 87 5 the clock on time would be extended to 21 μs 21 21 3 7 8 duty cycle In a high temperature situation if the thermal control circuit and ACPI MSRs automatic and on demand modes are used simultaneously the fixed duty cycle determined by automatic mode would take precedence Note On demand mode can not activate the power reduction mechanism of Thermal Monitor 2 4 2 6 System Considerations In...

Страница 31: ...hermal profile and greater than the PROCHOT activation temperature Once configured the temperature at which the THERMTRIP signal is asserted is neither re configurable nor accessible to the system 4 2 9 Cooling System Failure Warning It may be useful to use the PROCHOT signal as an indication of cooling system failure Messages could be sent to the system administrator to warn of the cooling failur...

Страница 32: ...terface is a proprietary single wire bus between the processor and the chipset or other health monitoring device At this time the digital thermal sensor is the only data being transmitted For an overview of the PECI interface refer to the PECI Feature Set Overview For additional information on the PECI refer to the Intel Core 2 Duo Extreme Processor X6800 and Intel Core 2 Duo Desktop Processor E60...

Страница 33: ...or E6000 Sequence Datasheet It is important to note that in this calculation the TC MAX and TDP are constant while ΨCA will vary according to the local ambient temperature TLA Table 1 shows an example of required thermal characterization parameters for the thermal solution at various TLAs This table uses the TC max and TDP from the datasheets These numbers are subject to change and in case of conf...

Страница 34: ... requirements The entire thermal solution from the heatsink design chassis configuration and airflow source needs to be optimized for server systems in order to obtain the best performing solution Intel has worked with a third party vendor to enable a heatsink design for the Intel Core 2 Duo E6400 E4300 and Intel Pentium Dual Core E2160 Processors for Embedded Applications for the PICMG 1 3 form f...

Страница 35: ...l Core E2160 Processor Based on lab test data the case to ambient ΨCA performance of heatsink was found to be 0 356 C W with 18 CFM of airflow through the heatsink fins This will allow a maximum TLA of 39 C and meet the processors Thermal Profile specification as described in the processor datasheet The estimated performance for additional airflows is shown in Figure 12 Figure 11 PICMG 1 3 Copper ...

Страница 36: ...ecifications stm It should be noted that due to the vertical orientation of the heatsink there might be some stresses in the board due to the heatsink weight 5 3 ATX BTX form factors For information regarding the Intel Thermal Mechanical Reference Design thermal solution and design criteria for the ATX and BTX form factor refer to the Intel Core 2 Duo Desktop Processor E6000 Sequence Thermal and M...

Страница 37: ...ner needs to account for altitude effects in the overall system thermal design to make sure that the TC requirement for the processor is met at the targeted altitude 5 5 Geometric Envelope for Intel Reference PICMG 1 3 Thermal Mechanical Design Figure 20 and Figure 21 in Appendix D give detailed reference PICMG 1 3 motherboard keep out information for the reference thermal mechanical enabling desi...

Страница 38: ...l QST Configuration and Tuning Manual Note Fan speed control algorithms and Intel QST in particular rely on a thermal solution being compliant to the processor thermal profile It is unlikely that any fan speed control algorithm can compensate for a non compliant thermal solution See Chapter 5 0 and Chapter 6 0 for thermal solution requirements that should be met before evaluating or configuring a ...

Страница 39: ...mined based upon the difference between current temperature readings and specific temperature targets A major advantage of a PID Algorithm is the ability to control the fans to achieve sensor temperatures much closer to the TCONTROL Figure 14 is an illustration of the PID fan control algorithm As illustrated in the figure when the actual temperature is below the target temperature the fan will slo...

Страница 40: ...e of algorithm Kp proportional gain Ki Integral gain Kd derivative gain The Intel Quiet System Technology Intel QST Configuration and Tuning Manual provides initial values for the each of the gain constants In addition it provides a methodology to tune these gain values based on system response Finally the fan speed change will be calculated using the following formula ΔPWM P Kp I Ki D Kd Figure 1...

Страница 41: ...ransport SST is a single wire bus that is included in the ICH8 to provide additional thermal and voltage sensing capability to the Manageability Engine ME Figure 16 shows the major connections for a typical implementation that can support processors with Digital thermal sensor or a thermal diode In this configuration a SST Thermal Sensor has been added to read the on die thermal diode that is in a...

Страница 42: ...nsors to provide devices for the SST bus Contact your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for your design Figure 16 Example Acoustic Fan Speed Control Implementation B6356 01 ME Intel G MCH Thermal Sensor Thermal Sensor Intel Pentium Dual Core Processor Intel CoreTM 2 Duo Processor LGA 7...

Страница 43: ...lity of these tools 6 4 Fan Hub Thermistor and Intel QST There is no closed loop control between Intel QST and the thermistor but they can work in tandem to provide the maximum fan speed reduction The BTX reference design includes a thermistor on the fan hub This Variable Speed Fan curve will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a ΨC...

Страница 44: ...d helps to reduce the combined joint tensile and shear stress Overall the heatsink required preload is the minimum preload needed to meet all of the above requirements Mechanical shock and vibration and TIM performance AND LGA775 socket protection against fatigue failure A 2 Metric for Heatsink Preload for Designs Non Compliant with Intel Reference Design A 2 1 Heatsink Preload Requirement Limitat...

Страница 45: ...flection is measured along either diagonal refer to Figure 18 d dmax d1 d2 2 d dmax d 1 d 2 2 Configurations in which the deflection is measured are defined in the Table 2 below To measure board deflection follow industry standard procedures such as IPC for board deflection measurement Height gauges and possibly dial gauges may also be used Table 4 Board Deflection Configuration Definitions Config...

Страница 46: ...3US A 2 3 Board Deflection Limits Deflection limits for the ATX µATX form factor are d_BOL d_ref 0 09 mm and d_EOL d_ref 0 15 mm and d _BOL d _ref 0 09 mm and d_EOL d_ref 0 15 mm Note 1 The heatsink preload must remain within the static load limits defined in the processor datasheet at all times 2 Board deflection should not exceed motherboard manufacturer specifications Figure 18 Board Deflection...

Страница 47: ...t the BOL and EOL preload and board deflection differ This is a result of the creep phenomenon The example accounts for the creep expected to occur in the motherboard It assumes no creep to occur in the clip However there is a small amount of creep accounted for in the plastic fasteners this situation is somewhat similar to the Intel Reference Design The impact of the creep to the board deflection...

Страница 48: ... deflect 0 37 mm minimum at BOL Additional deflection as high as 0 09 mm may be necessary to account for additional creep effects impacting the board clip fastener assembly As a result designs could see as much as 0 50mm total downward board deflection under the socket In addition to board deflection other elements need to be considered to define the space needed for the downward board total displ...

Страница 49: ... shock Board creep with high heatsink preload However the load required to meet the board deflection recommendation refer to Section A 2 3 with a very stiff board may lead to heatsink preloads exceeding package maximum load specification For example such a situation may occur when using a backing plate that is flush with the board in the socket area and prevents the board to bend underneath the so...

Страница 50: ... returns Unrestrained incremental increases in thermal interface material area do not translate to a measurable improvement in thermal performance B 3 Interface Material Performance Two factors impact the performance of the interface material between the processor and the heatsink base Thermal resistance of the material Wetting filling characteristics of the material Thermal resistance is a descri...

Страница 51: ...GA package for TC measurement This procedure takes into account the specific features of the 775 land LGA package and of the LGA775 socket for which it is intended The recommended equipment for the reference thermocouple installation including tools and part numbers are also provided In addition a video that shows the process in real time Thermocouple Attach Using Solder Video CD ROM is available ...

Страница 52: ...the mechanical drawings included in this appendix These drawings refer to the reference thermal mechanical enabling components for the processor Note Intel reserves the right to make changes and modifications to the design as necessary Drawing Description Page Number Figure 20 PICMG 1 3 Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Primary Side on page 5...

Страница 53: ...cessor Mechanical Drawings Intel CoreTM 2 Duo E6400 E4300 and Intel Pentium Dual Core E2160 Processor TDG October 2007 54 Order Number 315279 003US Figure 20 PICMG 1 3 Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Primary Side ...

Страница 54: ...Intel Pentium Dual Core E2160 Processor October 2007 TDG Order Number 315279 003US 55 Mechanical Drawings Intel CoreTM 2 Duo E6400 E4300 and Intel Pentium Dual Core E2160 Processor Figure 21 PICMG 1 3 Motherboard Keep out Secondary Side ...

Страница 55: ...ers are responsible for the verification of the Intel enabled component offerings with the supplier OEMs and System Integrators are responsible for thermal mechanical and environmental validation of these solutions Note These vendors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quali...

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