Intel BX80605X3440 - Quad Core Xeon X3440, Справочник

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Thermal/Mechanical Specifications and Design Guidelines 67
Thermal Solution Quality and Reliability Requirements
9
Thermal Solution Quality and
Reliability Requirements
9.1 Collaboration Heatsink Thermal Verification
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. The Intel collaboration thermal solution will be evaluated to the
boundary conditions in
Chapter 5 .
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3
σ
value for thermal characterization parameter using the TTV.
9.2 Mechanical Environmental Testing
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. Some general recommendations are shown in
Table 9-1 .
The Intel collaboration heatsinks have been tested in an assembled LGA1156 socket
and mechanical test package. Details of the environmental requirements, and
associated stress tests, can be found in
Table 9-1 are based on speculative use
condition assumptions, and are provided as examples only.
Notes:
1. It is recommended that the above tests be performed on a sample size of at least ten assemblies from
multiple lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
Table 9-1. Use Conditions (Board Level)
Test
1
Requirement Pass/Fail Criteria
2
Mechanical Shock 3 drops each for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops)
Profile: 50 g, Trapezoidal waveform, 4.3 m/s [170 in/s]
minimum velocity change
Visual Check and
Electrical Functional
Test
Random Vibration Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
5 Hz @ 0.01 g
2 /Hz to 20 Hz @ 0.02 g 2 /Hz (slope up)
20 Hz to 500 Hz @ 0.02 g 2 /Hz (flat)
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual Check and
Electrical Functional
Test
Thermal Cycling –25°C to +100°C;Ramp rate ~ 8C/minute; Cycle time:~30
minutes per cycle for 500 cycles.
Visual Check and
Thermal Performance
Test