Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
23
Thermal Metrology
3. Measure the thermocouple resistance by holding both contacts on the connector on
one probe and the tip of thermocouple to the other probe of the DMM
(measurement should be about ~3.0 ohms for 36-gauge type T thermocouple).
4. Straighten the wire for about 38 mm [1.5 inch] from the bead.
5. Using the microscope and tweezers, bend the tip of the thermocouple at
approximately 10 degree angle by about 0.8 mm [.030 inch] from the tip. Refer to
5.1.4.2
Thermocouple attach to the IHS
6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all
residues prior to thermocouple attachment.
7. Place the Thermocouple wire inside the groove and let the exposed wire extend
slightly over the end of groove. Refer to
Figure 5-5. Inspection of Insulation on Thermocouple
Figure 5-6. Bending the Tip of the Thermocouple
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Страница 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 44: ...Thermal Solution Component Suppliers 44 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
