Experience and Reliability in Radar Technology
disclosed by the recipient to third parties without prior consent of InnoSenT in writing.
SMT GUIDELINES
The SMR device is 100% Pb-free. Therefore, Pb-free solder paste with a Pb-free re flow profile is recommended.
Do not use solder paste with active or acid-based flux. To avoid submerging the device in the solder paste, the
placement height (Z) of the device on the pick-and-place equipment should be controlled carefully. Optimally, the Z
height should be set at one-half the printed solder paste height. Maintaining board flatness (coplanarity) is important
in keeping the Z height under control.
If possible use a pick-and-place machine with a visions-alignment system for proper centering on the PCB.
For the soldering process we recommend the following:
•
For optimum results the reflow oven should have nitrogen purge (we recommend 1000ppm)
•
To avoid damage during assembly solder re flow attachment, follow the guidelines in IPC/JEDEC J-STD-
020D.1. The device is qualified at 260 °C re flow. The following figure shows a typical temperature profile for
Pb-free (Sn-Ag-Cu or Sn-Ag) solder and the corresponding critical re flow parameters.
•
Assemble the SMR within 5 days after opening the packing
•
Not assembled SMR must be dried for 500h at 40 degree Celsius; 1% r.H. before repacking in a dry pack.
220
180
150
PACKAGE FOOTPRINT
Recommended Footprint and Stencil Layout
Time
Copper
1.05
2.2
Solder
A
2.15
Paste
Recommended stencil thickness 225µm
CONFIDENTIAL AND PROPRIETARY
The information contained in this document shall remain the sole and exclusive property of InnoSenT GmbH and shall not be
Max. 260°C, Min 230°C
Min. 60sec
Max. 120sec
Min. 30 sec
Max. 90sec
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