Innodisk nanoSSD 3IE, Руководство по конструкции

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nanoSSD Design Manual
20
Rev. 1. 5
MAR, 2016
4. Component Placement and Routing Requirements
This section states component placement and routing requirements of nanoSSD. Please refer to
attachments for reference design.
4.1 SATA Differential Signals
To comply with SATA interface specifications, the SATA differential lines must have 100 Ohm
differential impedance.
4.2 Power Distribution

The SATA AC coupling capacitors should be placed close to the host.

All decoupling capacitors and filters must be placed as close to the power supply pads as
possible.

The PCB stack up must include at least one solid ground plane.

All traces, except supply/ground and SATA differential pair, should have 50 ohm
single-ended impedance.
5. Temperature and Thermal
The maximum operating temperature of the nanoSSD is listed below, and must be maintained at
any time the device is active.
Temperature Range
Operating
Standard Grade: 0°C to +70°C
Industrial Grade: -40°C to +85°C
*The industrial grade item is only available in SLC item.
Storage -55°C to +95°C
Table 5 Temperature range of nanoSSD
Below are some recommendations for PCB design to lowest effect of thermal.

Maximize copper thickness and trace width for all pins to thermal features such as thermal
vias, thermal side rails, and thermal conduction screw holes.

Copper ground/supply planes in the PCB can provide very effective heat dissipation for the