Application Note
page 6 of 33
V1.7
2022-08-01
XENSIV™ BGT60LTR11AIP shield
60 GHz radar system platform
Hardware description
3
Hardware description
This section presents an overview of the BGT60LTR11AIP shield
’s
hardware building blocks, such as
BGT60LTR11AIP MMIC, power supply, crystal, and board interfaces.
3.1
Overview
The BGT60LTR11AIP shield is a very small PCB of 20 x 6.25 mm size. Mounted on top of the PCB is a
BGT60LTR11AIP, Infineon
’s 60 GHz radar sensor.
The antennas are integrated into the chip package; therefore,
the PCB can be manufactured using a standard FR4 laminate. The bottom side of the shield has the connectors
to the Radar Baseboard MCU7 [1] (P1 and P2 in Figure 2). On the top side of the shield, there is a marker that must
be aligned with the marker on the Radar Baseboard MCU7 for correct alignment, as shown in Figure 3.
The castellated holes on the edges of the PCB provide additional access to the detector outputs and power
supply signals of the shield. By using these castellated holes and removing P1 and P2, the BGT60LTR11AIP shield
can be soldered onto other PCBs.
20 mm
6.
25
mm
Top view
Bottom view
Sensor connectors (P1 and P2)
Castellated holes
Figure 2
Top and bottom views of BGT60LTR11AIP shield
60 GHz Radar System Platform
Markers for
correct
alignment
Figure 3
Markers on Radar Baseboar
d MCU7 and BGT60LTR11AIP shield for alignment
Note:
There is a risk of the connectors wearing out when regularly plugged into and unplugged from the shield. To
prevent this, do not lift the shield on the short side out of the connector. Instead, simply pull on the long side
of the sensor, thereby tilting the short side. This will significantly increase the lifetime of the connectors.
