Infineon Cypress EZ-BLE CYBLE-022001-00, Руководство пользователя

Страница: 11 / 42

CYBLE-022001-00
Document Number: 001-95662 Rev. *N Page 10 of 41
Digital and Analog Capabilities and Connections
Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on
CYBLE-022001-00, the Bluetooth LE device port-pin, and denotes whether the function shown is available for each solder pad. Each
connection is configurable for a single option shown with a
✓
.
Table 4. Solder Pad Connection Definitions
Solder Pad
Number
Device
Port Pin
UART SPI I
2
C TCPWM
[2,3]
Cap-
Sense
WCO
Out
ECO
Out LCD
SWD GPIO
1 GND
[4]
Ground Connection
2 P4.1
[5]
✓
(SCB1_CTS)
✓
(SCB1_MISO)
✓
(TCPWM0_N)
✓
(Sensor/
C
TANK
)
✓ ✓
3 P5.1
✓
(SCB1_TX)
✓
(SCB1_SCLK)
✓
(SCB1_SCL)
✓
(TCPWM3_N)
✓
(Sensor)
✓ ✓ ✓
4 P5.0
✓
(SCB1_RX)
✓
(SCB1_SS0)
✓
(SCB1_SDA)
✓
(TCPWM3_P)
✓
(Sensor)
✓ ✓
5 V
DDR
Radio Power Supply (1.9V to 5.5V)
6 P1.6
✓
(
SCB0_RTS
)
✓
(SCB0_SS0)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
7 P0.7
✓
(SCB0_CTS)
✓
(SCB0_SCLK)
✓
(TCPWM)
✓
(Sensor)
✓
✓
(SWDCLK)
✓
8 P0.4
✓
(SCB0_RX)
✓
(SCB0_MOSI)
✓
(SCB0_SDA)
✓
(TCPWM)
✓
(Sensor)
✓ ✓ ✓
9 P0.5
✓
(SCB0_TX)
✓
(SCB0_MISO)
✓
(SCB0_SCL)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
10 GND Ground Connection
11 P0.6
✓
(SCB0_RTS)
✓
(SCB0_SS0)
✓
(TCPWM)
✓
(Sensor)
✓
✓
(SWDIO)
✓
12 P1.7
✓
(SCB0_CTS)
✓
(SCB0_SCLK)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
13 V
DD
Digital Power Supply Input (1.71 to 5.5V)
14 XRES External Reset Hardware Connection Input
15 P3.5
✓
(SCB1_TX)
✓
(SCB1_SCL)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
16 P3.4
✓
(SCB1_RX)
✓
(SCB1_SDA)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
17 P3.7
✓
(SCB1_CTS)
✓
(TCPWM)
✓
(Sensor)
✓ ✓ ✓
18 P1.4
✓
(SCB0_RX)
✓
(SCB0_MOSI)
✓
(SCB0_SDA)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
19 P1.5
✓
(SCB0_TX)
✓
(SCB0_MISO)
✓
(SCB0_SCL)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
20 P3.6
✓
(SCB1_RTS)
✓
(TCPWM)
✓
(Sensor)
✓ ✓
21 P4.0
[6]
✓
(SCB1_RTS)
✓
(SCB1_MOSI)
✓
(TCPWM0_P)
✓
(C
MOD
)
✓ ✓
Notes
2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
3. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either positive
or negative polarity. TCPWM connections on ports 4 and 5 are direct and can only be used with the specified TCPWM block and polarity specified above.
4. The main board needs to connect both GND connections (Pad 1 and Pad 10) on the module to the common ground of the system.
5. When using the capacitive sensing functionality, Pad 2 (P4.1) can be connected to a C
TANK
capacitor (located off of Cypress Bluetooth LE Module). C
Tank
should
be used if implementing a shield layer on the capacitive sensor. If used, this capacitor should be placed as close to the module as possible.
6. When using the capacitive sensing functionality, Pad 21 (P4.0) must be connected to a C
MOD
capacitor (located off of Cypress Bluetooth LE Module). The value
of this capacitor is 2.2 nF and should be placed as close to the module as possible.
7. If the I
2
S feature is used in the design, the I
2
S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator