Table 3. Additional system parts (continued)
Index
number
Part number
Units per assembly Description
17
M393A1G40DB0-
CPB
16
8 GB, 2133 MHz 1RX4 DDR4 RDIMM (Samsung Electronics
Co., Ltd.)* (8001-12C)
17
M393A2G40DB0-
CPB
16
16 GB, 2133 MHz 2RX4 DDR4 RDIMM (Samsung Electronics
Co., Ltd.)* (8001-12C)
17
M393A4K40BB0-CPB 16
32 GB, 2133 MHz 2RX4 DDR4 RDIMM (Samsung Electronics
Co., Ltd.)* (8001-12C)
17
HMA41GR7AFR4N-
TF
16
8 GB, 2133 MHz 1RX4 DDR4 RDIMM (SK hynix, Inc.)*
(8001-12C)
17
HMA42GR7AFR4N-
TF
16
16 GB, 2133 MHz 2RX4 DDR4 RDIMM (SK hynix, Inc.)*
(8001-12C)
17
HMA84GR7MFR4N-
TFT1
16
32 GB, 2133 MHz 2RX4 DDR4 RDIMM (SK hynix, Inc.)*
(8001-12C)
17
MEM-DR480L-HL02-
ER21,
MEM-DR480L-SL01-
ER21, or
MEM-DR480L-CL03-
ER24
16
8 GB, 2133 MHz 2RX4 DDR4 ISRDIMM (Super Micro
Computer, Inc.)* (8005-12N)
17
MEM-DR416L-CL03-
ER24,
MEM-DR416L-SL01-
ER21, or
MEM-DR416L-HL02-
ER21
16
16 GB, 2133 MHz 2RX4 DDR4 ISRDIMM (Super Micro
Computer, Inc.)*
18
SSD-DM064-PHI
2
64 GB SATA drive on module (DOM) (8001-12C)
18
SSD-DM064-
SMCMVN1
2
64 GB SATA drive on module (DOM) (8005-12N)
18
SSD-DM128-
SMCMVN1
2
128 GB SATA drive on module (DOM) (8001-12C)
19
MBD-P8DTU-1U-
IB001,
MCP-74Y4912-IB001,
and
MCP-01AF132-IB001
1
System backplane kit (includes system backplane, tray, and
vacuum pen)
Note:
You must order all three part numbers to receive all of
the kit contents.
20
14
Screws
21
CPU-KIT-00E4887-
IB001
2
8 core 2.328 GHz system processor module kit (includes
system processor, tray, and vacuum pen) (8001-12C)
CPU-KIT-01EM061-
IB001
2
10 core 2.095 GHz system processor module kit (includes
system processor, tray, and vacuum pen)
22
SNK-P0052P-IB001
2
Heat sink kit (includes heat sink and thermal interface
material)
*All of the memory in a 8001-12C system must be the same size and from the same supplier. The
8001-12C system does not support mixing different sizes of memory or mixing memory from different
suppliers. All of the memory in a 8005-12N system must be the same size and from the same supplier.
The 8005-12N system does not support mixing different sizes of memory or mixing memory from
different suppliers.
7
