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8. Inspect the thermal interface material (TIM) for visible signs of damage, as shown in Figure 43.
Note:
When the heat sink is removed from the failed microprocessor, the TIM should be adhered to
the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused. Replacing the
TIM is optional and is only performed if the TIM is damaged. Do not reuse the removed heat sink if
the TIM is damaged. Either discard the heat sink and the damaged TIM locally or return them to
IBM based on the part-order-form part status.
Figure 42. Installing the microprocessor
Figure 43. Inspecting the thermal interface material
Chapter 6. Installing and removing components
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