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USER RESPONSIBLE F O R V E R I F Y I N G VERSION A N D COMPLETENESS
O E M F U N C T I O N A L SPECIFICATION ULTRASTAR X P (DFHC) SSA M O D E L S 1.12/2.25 GB - 1.0" H I G H
Table 15. Maximum and Reliability Operating Temperature Limits
Maximum
Reliability
Disk Enclosure Top
158˚ F
(70˚ C)
131˚ F
(55˚ C)
Disk Enclosure Bottom
158˚ F
(70˚ C)
131˚ F
(55˚ C)
P R D F Prime Module
203˚ F
(95˚ C)
176˚ F
(80˚ C)
W D 61C40 Module
185˚ F
(85˚ C)
167˚ F
(75˚ c)
SIC Module
203˚ F
(95˚ C)
176˚ F
(80˚ C)
Microprocessor Module
194˚ F
(90˚ C)
167˚ F
(75˚ C)
VCM F E T
194˚ F
(90˚ C)
167˚ F
(75˚ C)
D C / D C Converter (CxB only)
185˚ F
(85˚ C)
167˚ F
(75˚ C)
SMP F E T
194˚ F
(90˚ C)
167˚ F
(75˚ C)
Note 1: Module temperature measurements should be taken from the top surface of the module.
Note 2: If copper tape is used to attach temperature sensors, it should be no larger than 6 square milli-
meters.
notes:
1) dimensions are in millimeters.
Figure 22. Temperature Measurement Points for All Models (top view of DE)
Source filename=OPLIMITS
IBM Corporation
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