Copyright © 2014 IBASE Technology Inc. All Rights Reserved.
7
IBASE Technology Inc.
1.2 System Specifications
1.2.1 Hardware Specifications
Specification
–System
CPU
Model
3nd Generation Core I ™ processor, Ivy bridge
-
Part number: (
iBASE or Vender P/N
)
Sub-sub 1
Model
3nd Generation Core I ™ processor, Ivy bridge
-
Part number: (
iBASE or Vender P/N
)
Sub-sub 1
Speed
Up to 2.7GHz
Cache
Up to 8MB
Socket
rPGA 988B (Socket G2) , 37.5 mm x 37.5mm
Passive CPU cooling, heat sink plus system fan.
TDP
QC = 45W/ DC = 35W
Memory
Configuration
Intel
®
Ivy-Bridge mobile processors integrated memory controller
DDRIII 1067/1333/1600 MHz
-
SO-DIMM [204-pin Horizontal type stacking] x 2
(Non-ECC)
-
Memory socket to be located near CPU
Max. Support
Max. 16GB
Onboard
backup
memory SRAM
-
512k SRAM (C02S0903000007000P)
-
attach the 1/2AA battery holder (A043HDBAT11030000P ) to the
removable plate on the rear side of the chassis
Rear Panel I/O
**reference appendix 1**
Other
-
7-segment display: LPC 80 port Via ABP-ID45
DF11-26pin (2 rows) to DF11-26pins (2 rows) extension cable
PN: C501EXT3170152000P
-
Fan
60mm x 60mm DC Fan x1 for CPU (on rear chassis).
50mm x 50mm DC Fan x 1 for PSU(on front Side).
-
CPU fan x 1.
Front Panel I/O
**reference appendix 1**
Display
-
2 x DVI-I connector
