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XXXX   

The basic version

 

Repair

 

Manual

V1.0 

internal public

 

 

2013-09-25

 

            Huawei

 

confidential,

 

not to spread

 

without permission

 

第 3 页，共 79 页 

 

 

Catalogue

CHAPTER 1 PRODUCT PROFILE

 .................................................................................................................. 4 

1.1 

P

RODUCT 

P

ICTURE

 .................................................................................................................................... 4 

1.2 

C

HARACTERISTICS OF THE 

P

RODUCT

.

 ....................................................................................................... 4 

CHAPTER 2 REPAIR INSTRUCTIONS

 ........................................................................................................... 6 

1.3 

D

OCUMENTATION

 ........................................................................................................................................ 6 

1.4 

R

EPAIR THE MATTERS NEEDING ATTENTION

 ............................................................................................... 6 

1.5 

R

EPAIR INFORMATION ACQUISITION GUIDE LINES

 ...................................................................................... 6 

CHAPTER 3 PHONE EXPLOSION

 .................................................................................................................. 7 

CHAPTER 4 PCBA COMPONENT LOCATION DIAGRAM

 ......................................................................... 9 

CHAPTER 5 SW UPGRADE

 ........................................................................................................................... 11 

5.1

 

R

EADY FOR UPGRADING

 ............................................................................................................................ 11 

5.2

 

U

PGRADE HARDWARE CONNECTION

 .......................................................................................................... 11 

5.3

 

USB

 

D

RIVER INSTALLATION

 ....................................................................................................................... 12 

5.4

 

U

PGRADE 

P

ROCESS

 .................................................................................................................................. 15 

5.4.1

 

U

SE

“

FLASH TOOL

”

 TOOL

 ........................................................................................................................................ 15 

5.4.2

 

C

ONFIGURE FLASHTOOL DOWNLOAD TOOL

 ............................................................................................................ 15 

5.5

 

SD

 UPGRADE

 ............................................................................................................................................. 20 

5.6

 

E

XCEPTION 

H

ANDLING

 ............................................................................................................................... 24 

CHAPTER 6 SERVICE TOOL

 ......................................................................................................................... 25 

CHAPTER 7 DISASSEMBLE STEP

 .............................................................................................................. 27 

CHAPTER 8 INSTALL STEP

........................................................................................................................... 30 

CHAPTER 9 PRINCIPLE AND FAULT ANALYSIS

 ..................................................................................... 34 

9.1

 

P

RINCIPLE 

D

IAGRAM AND 

I

NTRODUCTION

.

 ................................................................................................ 34 

9.2

 

B

ASEBAND

.................................................................................................................................................. 36 

9.2.1

 

P

OWER 

M

ANAGEMENT 

C

IRCUIT

 ............................................................................................................................ 36 

9.2.2

 

C

HARGING 

M

ANAGEMENT 

C

IRCUIT

 ....................................................................................................................... 42 

9.2.3

 

C

LOCK 

C

IRCUIT

 ....................................................................................................................................................... 44 

9.2.4

 

F

LASH 

C

IRCUIT

 ....................................................................................................................................................... 46 

9.3

 

RF

 

U

NIT

 ...................................................................................................................................................... 48 

9.3.1

 

R

ECEPTION 

C

HANNEL

 ................................................................................................................................................. 54 

9.3.2

 

T

RANSMITTING CHANNEL

 ............................................................................................................................................. 57 

9.4

 

E

XTERNAL 

C

IRCUIT

 ........................................................................................................................................ 60 

9.4.1

 

D

ISPLAY

 ................................................................................................................................................................. 60 

9.4.2

  

K

EYPAD

 ................................................................................................................................................................. 63 

9.4.3

 

V

IBRATION

 .............................................................................................................................................................. 64 

9.4.4

 

R

ECEIVER

 ................................................................................................................................................................ 65 

9.4.5

 

M

IC

 ....................................................................................................................................................................... 67 

9.4.6

 

E

ARPHONE

 ................................................................................................................................................................ 69 

9.4.7

 

SIM

 

C

ARD

 .............................................................................................................................................................. 70 

9.4.8

 

I

NTERFACE

 .............................................................................................................................................................. 73 

9.4.9

 

SD

 

C

ARD 

I

NTERFACE

 ................................................................................................................................................ 74 

9.4.10

 

CAM

 .................................................................................................................................................................... 75 

9.4.11

 

BT/WIFI/FM/GPS

 

F

AILURE

 ................................................................................................................................. 78 

9.4.12

 

O

THER COMMON 

F

AILURE

 ..................................................................................................................................... 79 

Содержание Y511-U030

Страница 1: ...ll use Times New Roman font English version repair manual font all use Arial fonts Document of the second chapter and the sixth chapter is the fixed content without any modification XXXX Repair Manual V1 0 Artificial Date Review Date Approval Date Transient suppression diode 2 华为技术有限公司 Huawei Technologies Co Ltd 版权所有 侵权必究 All rights reserved ...

Страница 2: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 2 页 共 79 页 Revision record Date Release version Revision cause Modify chapter Revision description Author ...

Страница 3: ...PGRADE PROCESS 15 5 4 1 USE FLASH TOOL TOOL 15 5 4 2 CONFIGURE FLASHTOOL DOWNLOAD TOOL 15 5 5 SD UPGRADE 20 5 6 EXCEPTION HANDLING 24 CHAPTER 6 SERVICE TOOL 25 CHAPTER 7 DISASSEMBLE STEP 27 CHAPTER 8 INSTALL STEP 30 CHAPTER 9 PRINCIPLE AND FAULT ANALYSIS 34 9 1 PRINCIPLE DIAGRAM AND INTRODUCTION 34 9 2 BASEBAND 36 9 2 1 POWER MANAGEMENT CIRCUIT 36 9 2 2 CHARGING MANAGEMENT CIRCUIT 42 9 2 3 CLOCK C...

Страница 4: ... 1 1 Product Picture 1 2 Characteristics of the Product Description the product characteristics shall include information the most basic hardware characteristics such as mobile phone appearance size weight type frequency band interface the display parameters cell parameters Item description Phone Size 132 8 67 4 10 5 Phone weight About 160g Including battery ...

Страница 5: ...5v 1A LCM 4 5 inch FWVGA TN 1600 Million color 380cd m2 typ Working Environment Working temperature 10 55 Storage temperature 40 70 Operating humidity 5 95 RH Technical Standard Standard mobile phone technology of WCDMA digital Work Frequency Band UMTS 900 2100 GSM EDGE 900 1800 GSM 900MHz upgoing 880MHz 915 MHz down 925MHz 960MHz GSM 1800MHz upgoing 1710MHz 1785MHz down 1805MHz 1880MHz Maximum Tr...

Страница 6: ...nvironmental protection lead free welding 1 4 Repair the matters needing attention Repair and adjustment only by qualified personnel operation Ensure all work is to wear anti static belt and operation in anti static studio Ensure that all components screws and an insulator in the repair and adjustment are installed And to ensure that all cables and wires have been installed in place Welding should...

Страница 7: ...e to digital serial number label and the sequence number corresponding to that device list name quantity 2 Images need to use the drawing canvas frame up Explosion lists Describe the whole structure description graph is BOM explosion in the table below can not be used as a reference for spare parts No description Huawei material number Single dose 1 S98511A1 CTP 1 2 S98511A1 Light guide film 1 3 S...

Страница 8: ...11A1 Battery 1 9 S98511A1 Main antenna bracket assembly 1 10 S98511A1 Back cover assembly 1 11 Black bolt 4 12 S98511A1 Battery cover assembly 1 13 Silver screw 5 14 S98511A1 Camera lens 1 15 S98511A1 GPS WIFI antenna 1 16 S98511A1 1020 Motor 1 17 S98511A1 2014 Speaker 1 18 S98511A1 side key FPC assembly 1 19 S98511A1 back CAM 1 20 S98511A1 front CAM 1 21 S98511A1 Proximity sensor 1 22 1506 receiv...

Страница 9: ... provide a positive and negative picture need to mark the main device on a PCBA board tagging content includes No device name damage caused by fault phenomenon 2 Image requirements to clear for the device image annotation users can find the real position corresponding to the need to use the picture frame drawing canvas 3 The picture on the label and instructions corresponding to the characters mus...

Страница 10: ...d seat Damage caused by fault Not read SIM card CON301 battery interface Damage caused by fault No boot no charging U301 power management chip Damage caused by fault No boot audio fault not read SIM card not read T card no download etc U600 RF transceiver chip caused by fault RF fault U1000 BT WIFI GPS FM Chip caused by fault BT WIFI GPS FM function fault J0003 BTB interface caused by fault rear C...

Страница 11: ...cture need to use the drawing canvas frame up 4 The picture on the label and instructions corresponding to the characters must be editable 5 1 Ready for upgrading ITEM CONTENT Remark Upgrade environment Computer Operating system Windows 2000 Windows XP USB Date cable BOM 02450768 Upgrade tool FPQPML01 Micro SD 512M Battery Battery must be greater than 20 Upgrade file XXXX This is the reference ver...

Страница 12: ...ing if not the developer settings option please click mobile phone menu click on the fast version number column of about 5 times which will prompt in developer mode then back to the set interface will see developers options menu and then use the upgraded lines connected mobile phone and PC terminal PC terminal will pop up later driver installation tips operation process diagram as follows No no T ...

Страница 13: ...on 第 13 页 共 79 页 Select install from a list or specify the location Senior S option click Next to continue installation Select search for the best driver option in these locations select include this location in the search click Browse button to select the driver file SP_Drivers_v1 5 click next to continue installation ...

Страница 14: ...al not to spread without permission 第 14 页 共 79 页 Wait a moment the installation is complete the following diagram Click finish button to complete the installation After the installation is completed in the computer device manager will appear in the corresponding COM port as shown below ...

Страница 15: ... Use flash tool tool 1 This download tools do not need to install double click the folder Flash_tool exe operation to open the tool software after the operation of the interface is as follows 5 4 2 Configure flashtool download tool 1 Under the Options USB Mode download mode the configuration of Speed in DA Download All to High Speed Force The following diagram ...

Страница 16: ...Force to High Speed 2 Download Agent options click on the interface select the Flash_tool folder in the MTK_AllInOne_DA bin file The following diagram 3 Click the Scatter loading button figure a red box shown in the corresponding button path selection you need to download the software package of scatter file file the words scatter Txt file open as shown in Fig two Fig 1 ...

Страница 17: ...dential not to spread without permission 第 17 页 共 79 页 Fig 2 To download the package related documents of all after the OK implementation the interface is shown below 5 4 3 Software upgrade of USB for Y511 1 Click the Firmware Upgrade button to start the download display interface ...

Страница 18: ...n 2 The USB cable to connect the PC machine mobile phone battery is out or not to unplug the battery but to ensure that the mobile phone is switched off USB cable to connect the mobile phone terminal to download the download process as shown in Figure one two three four sequence is shown Fig 1 Fig 2 Fig 3 Fig 4 3 Upgrade is complete when the download progress display interface 100 Green box OK mea...

Страница 19: ...ect the loading file scatter file click the Firmware Upgrade button select OK then connect the mobile phone mobile phone connection first remove the battery or the mobile phone shutdown then connect the PC download The Firmware Upgrade button and Download button is to start the download button but because the more import to download the file if due to misoperation or other circumstances lead to im...

Страница 20: ...phone operation mode 1 The SD card root directory create folder dload the SD card upgrade package name changed to update zip placed in the dload folder namely the SD card upgrade path for SD card root directory dload update zip 2 Boot entrance case SD card upgrade are the settings memory software update memory card to upgrade warning interface to determine the OK started off into the automatic upg...

Страница 21: ...own condition SD card upgrade 1 The SD card root directory create folder dload the SD card upgrade package name changed to update zip placed in the dload folder namely the SD card upgrade path for SD card root directory dload update zip 2 The off state power volume volume down button until the screen to enter the following interface charge ...

Страница 22: ... version Repair ManualV1 0 internal public 2013 09 25 Huawei confidential not to spread without permission 第 22 页 共 79 页 3 Press the volume up and down keys to move the cursor to the apply update from external sdcard ...

Страница 23: ... Repair ManualV1 0 internal public 2013 09 25 Huawei confidential not to spread without permission 第 23 页 共 79 页 Press the power key to enter the upgrade interface upgrade boot automatically after the completion of upgrading ...

Страница 24: ...t find port 1 Check whether there are other drivers conflict 2 Check whether the driver is installed properly 3 Check the cable is connected properly Data cable upgrade failed 1 Check the cable is connected properly 2 Try to upgrade again SD card upgrade failed 4 1 Whether the update file is correct 5 2 Whether upgrading method is correct 6 3 Whether SD card can be used normally 7 4 Try to upgrade...

Страница 25: ... 6 Service Tool Name constant temperature air gun Application heating device Name constant temperature air gun Application heating device Name Iron Use repair welding Name DC power supply Purpose to provide current Name Soldering Station Application fixed board Name lead free solder wire Use Welding Name Digital Multimeter Use repair measure ...

Страница 26: ...asic version Repair ManualV1 0 internal public 2013 09 25 Huawei confidential not to spread without permission 第 26 页 共 79 页 Name Kit Use remove terminal products Name electric screwdriver Use disassembling screw ...

Страница 27: ... a picture box to replace the picture Insert picture can replace the existing picture For the different proportion of picture template graphics frame may not match you can adjust the size but must ensure that the layout and template with the same 4 remove back shell 3 Between the shell opener loose shell and the front shell buckling 2 9 screws using a screwdriver to unscrew the rear casing 1 remov...

Страница 28: ...anualV1 0 internal public 2013 09 25 Huawei confidential not to spread without permission 第 28 页 共 79 页 8 Remove 2 screws 9 Remove antenna 6 Loosen LCD FPC TP FPC volume keys 10 Remove front CAM 7 remove PCBA 5 remove two pice mylar ...

Страница 29: ...ublic 2013 09 25 Huawei confidential not to spread without permission 第 29 页 共 79 页 11 Remove Main CAM 14 Remover receiver adhesive tape 13 Remove MIC welding 12 remover volume key FPC Motor Speaker welding 15 Remove receiver rubber sleeve 16 Remover TP ...

Страница 30: ...dential not to spread without permission 第 30 页 共 79 页 Chapter 8 Install Step 6 Stick adhesive tape on the receiver 5 Receiver rubber sleeve put in front shell 4 TP put in front shell 3 LCD put in front shell 2 Product assembly 1 Ensure that the anti static Bracelet good grounding ...

Страница 31: ...V1 0 internal public 2013 09 25 Huawei confidential not to spread without permission 第 31 页 共 79 页 7 Welding MIC 8 Welding volume key FPC SPK Motor 9 Install main CAM 10 Install front CAM 11 Install antenna 12 Lock 2 screws fixed antenna ...

Страница 32: ...anualV1 0 internal public 2013 09 25 Huawei confidential not to spread without permission 第 32 页 共 79 页 18 Lock 9 screws 17 Install back shell 16 Install TP FPC LCD FPC 15 Stick two pice mylar 13 Install PCBA 14 Fixed volume key FPC ...

Страница 33: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 Huawei confidential not to spread without permission 第 33 页 共 79 页 20 Install battery cover 19 Install lens ...

Страница 34: ...l factors Factory set up again 9 1 Principle Diagram and Introduction Y511 U00 is an independent research and development of MTK based on MT6572 platform of WCDMA GSM mobile phone the main chip and integration of AP and CP integrated abundant peripheral interfaces Pictured above is a typical application of principle diagram of MT6572 The application of Y511 U00 mobile phone according to their own ...

Страница 35: ...T6572 EMMC DDR2 PMU RF transceiver RF switch and power amplifier WIFI GPS BT FM four in one device photosensitive distance sensor gravity sensor G511 U00 products such as screen resolution of FWVGA dot number 480 854 support Micro USB interface support for high speed transmission support 3 5mm earphone interface ...

Страница 36: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 36 页 共 79 页 9 2 Baseband 9 2 1 Power Management Circuit Circuit Principle Diagram ...

Страница 37: ... public 2013 09 25 华为机密 未经许可不得扩散 第 37 页 共 79 页 In the off state there are four events can trigger the boot press the start button HF_PWR set high insert the charger And RTC alarm The trigger event electrical schematic diagram of key is pressed on the ...

Страница 38: ...1 DCDC2 DCDC4 DCDC3 LDOA8 9 10 and USB powered LDOD6 in turn power supply DCDC interval of about 213us LDO interval of about 61us Whether the eMMC powered LDOD7 opening is controlled by the LDOD7EN pin 4 PMU sends the RSTOUTB signal the DBB reset reset signal from the LDOD1 opened at least 100ms calculation 5 After the reduction OSCEN high LDOA1 2 3 4 5 is opened by the corresponding LDOxEN extern...

Страница 39: ...ernal power supply it is best to have the output current and output voltage and current protection in short will automatically cut off the output current so that the mobile phone does not have more damage adjusting supply voltage is 4 0V output can supply current is appropriate for the 1 0A For the power PCBA current situation observation stable 1 The current is too small 10MA common main clock do...

Страница 40: ... process 2 Insert the charger does not boot In the presence of a battery into the charger is no reaction no charging indicator first check the battery contact is good then there is no problem to further observe the output current charger using an external power supply with current indication for charger size as the basis if the charger without output current charging to check the USB connector on ...

Страница 41: ...Hz master clock signal are normal To replace or re welding of 26MHz crystal CPU Check the 32 768Khz clock signal are normal replace or re weld the side the clock CUP Check VDD CORE VDDIO VDD MEM VRF the voltage is normal Check CPU Flash has no weld and damage Re download the software END Inspection of all VBAT related circuit device change adverse replace or re welding of CPU replace or re welding...

Страница 42: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 42 页 共 79 页 9 2 2 Charging Management Circuit Circuit Principle Diagram ...

Страница 43: ... a mobile phone while charging display but not to charge the battery The fault plane is not charging please I O interface detection see if there are any obvious damage Please refer to the specific repair process is as follows Not Charging replacement of charging line is OK Check the charging port IO whether there is a 5V input voltage Check U303 U305 soldering and ontology is good PMU chip is weld...

Страница 44: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 44 页 共 79 页 9 2 3 Clock Circuit Circuit Principle Diagram ...

Страница 45: ...tem clock source a dormant or shutdown state to keep the system time or timing function to reduce the system power consumption 32 768kHz crystal clock circuit needs an external input output the crystal at both ends are respectively connected with the baseband chip clock driver As the clock bad will lead to not boot failure Fault analysis and treatment process Can not boot failure can first check w...

Страница 46: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 46 页 共 79 页 9 2 4 Flash Circuit Circuit Principle Diagram ...

Страница 47: ...uit is adverse there will be not be able to boot failure Fault analysis and treatment process First visual inspection flash chip are obviously abnormal whether the chip tilt extrusion etc The multimeter is used to measure the flash power supply VDD18 VMEM are normal Normal VDD18 VME should be 1 7 1 9V The typical value is 1 8V If these are normal may be flash chip body has a problem need to replac...

Страница 48: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 48 页 共 79 页 9 3 RF Unit Circuit Principle Diagram ...

Страница 49: ...c version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 49 页 共 79 页 Circuit analysis Transceiver uses the MTK MT6166 VFBGA104 0 4pitch 4 7 4 7 0 9mm package The basic block diagram is shown as follows ...

Страница 50: ...经许可不得扩散 第 50 页 共 79 页 GSM RF PA using Skyworks chip SKY77590 an integrated RF antenna switch amplifier filter circuit and so on 6 6 6 0 85mm chip block diagram is shown as follows WCDMA RF PA uses the SKY77761 and SKY77768 of Skyworks company the chip block diagram as follows ...

Страница 51: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 51 页 共 79 页 SKY77761 Principle Diagram SKY77768 Principle Diagram ...

Страница 52: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 52 页 共 79 页 SKY77761 Pad definition ...

Страница 53: ...ersion Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 53 页 共 79 页 SKY77768 Pad definition The vibration of the external crystal using high precision TCXO nominal frequency is 26MHz the precision is 2 0ppm ...

Страница 54: ...可不得扩散 第 54 页 共 79 页 9 3 1 Reception Channel Circuit Principle Diagram Circuit analysis The receiving part of the circuit includes an antenna switch integrated in the RF power amplifier inside U1 U616 U607 transceiver chip U600 MT6166 matching circuit The SKY77590 control logic ...

Страница 55: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 55 页 共 79 页 Following chart is repair process ...

Страница 56: ...RF power amplifier The transceiver chip U600 MT6166 the CPU is damaged To replace or re welding transceiver chip U600 replace or re bad welding device If there any signal No signal display check the circuit of RF system Check the matching circuit components have break or weld Check U616 U607 are normal The receive path reference emission pathway END Check the antenna contact and the PCBA antenna f...

Страница 57: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 57 页 共 79 页 9 3 2 Transmitting channel Circuit Principle Diagram ...

Страница 58: ...chip The control logic Fault analysis and treatment process Such as playing no phone no signal the signal is weak first confirm the antenna feed point contact with the motherboard no stolen goods Then check the working voltage of U1 is normal such as matching network device schematic diagram has no bad weld short circuit phenomenon after eliminating the adverse change welding according to the main...

Страница 59: ...RF power amplifier The transceiver chip U600 MT6166 the CPU is damaged To replace or re welding transceiver chip U600 replace or re bad welding device If there any signal No signal display check the circuit of RF system Check the matching circuit components have break or weld Check U616 U607 are normal The receive path reference emission pathway END Check the antenna contact and the PCBA antenna f...

Страница 60: ... is provided by power chip LC1100 interface voltage is provided by power chip LC1100 Fault analysis and treatment process LCD showed abnormal causes for the EMI filter weld solder solder or solder lead 1 White display Huaping first confirm the software correctly LCD good welding should be no weld short circuit phenomenon the contact point should be clean no residual solder paste help and dirt fina...

Страница 61: ...0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 61 页 共 79 页 paste help and dirt final inspection path CPU backlight output port and the LCD terminal and peripheral devices work is normal Re welding or replace the related devices Repair process ...

Страница 62: ...onnector welding is good Check LCD and connector contact is good check signal connectivity Check whether the normal power supply voltage VDDIO LCD END Re welding of EMI devices Remove and re welding LCD connector Replace the LCD or re welding LCD connector processing Re welding or replacement of CPU and screen display device Re welding or replacement of CPU Y Y Y Y Y Y N N N N N ...

Страница 63: ... a power button button under the volume 3 physical buttons The remaining three for the virtual keys The power button please start circuit reference before Fault analysis and treatment process 1 Key failure check the main side key FPC welding and DOME and PCB are dirty 2 If no dirt may be the main chip has a problem need to be welded or replacement of the main chip ...

Страница 64: ... motor working voltage 2 5V current 70mA Direct motor is controlled by the power chip Fault analysis and treatment process 1 First confirm the motor welding is good 2 Separate to the motor power supply to see whether the normal work of the motor 3 To determine the motor body no problem it may be the power chip weld or power supply chip body bad need to add or replace the power supply chip welding ...

Страница 65: ... supply chip circuit output external 32 ohm headphones Fault analysis and treatment process First confirm the receiver itself is good can replace the test receiver uses the shrapnel crimping confirm the good and PCBA pressure the contact point should be clean no dirt pathway finally check voice signal AU_HSP AU_HSN and power supply chip according to bad welding or more power supply chip ...

Страница 66: ... 共 79 页 No sound Check whether the normal operating current The receiver circuit device without break or weld Connectivity check each signal END Check the receiver and PCBA contact is good Re welding or replace the bad device Check the power supply chip replace or re welding Y Y Y Y N N N ...

Страница 67: ...rmal work power supply chip provides a bias voltage to the microphone the microphone to pickup signal through a coupling capacitor into the power chip Fault analysis and treatment process No words can check whether the normal pathway of MIC welding voice input signal AU_VIN0_P AU_VIN0N and power supply chip Bad welding or replace the relevant device according to the chip power supply MIC periphera...

Страница 68: ...ther the normal operating current MIC circuit device without break or weld Connectivity check each signal Check the MIC circuit device has no break or weld END Check MIC welding has no short circuit To replace or re welding of MIC Check U301 replaced or re welding Re welding or replace the bad device Y Y Y Y Y N N N N ...

Страница 69: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 69 页 共 79 页 9 4 6 Earphone Circuit Principle Diagram ...

Страница 70: ... earphone check on the earphone detecting signal EAR_DET is normal can MIC headset headset microphone circuit identification but have fault if available pathway between HP_MIC 1 HP_MP3L 1 see the EAR_DET and U301 is normal headset MIC circuit device is damaged Detection Process Insert headphones have no icon Check whether the normal operating current Check the MIC headset line device is weld break...

Страница 71: ...s and treatment process The boot can not find the SIM card the card good structure contact should be clean and elastic line device if short circuit voltage is normal Note not in the inserted SIM card only moment in the boot can be measured about 2 8V VSIM multimeter some deviation need to use oscillograph can be more accurately measure Check the SIM card and the PMU signal pathway is normal bad we...

Страница 72: ...f each contact has no elasticity or weld Check whether the signal is ok Check whether the normal working voltage VSIM SIM card Check SIM card peripheral devices have no weld or short circuit END Check the related devices have no short circuit To replace or re welding of SIM card seat Check PMU processing the fault point Check PMU has no weld or damaged replacement of devices or welding Y Y Y Y Y Y...

Страница 73: ...s IO connector using the 5PIN Micro USB connector mainly involving the functions including USB download USB data transmission USB data transmission with a standard definition of USB Fault analysis and treatment process IO connector weld welding even damage will result in not charging unable to download The repair can be related chapters reference before ...

Страница 74: ...ding memory data signal CMD signal GND signal power in good faith Fault analysis and treatment process 1 The first detection of the T card holder connector shrapnel is tilted dirt etc To ensure good contact connector and method 2 check the T card hot plug detect whether the Pin is normal 3 Multimeter is used to measure the memory seat power supply is normal 4 these are normal need to be replaced o...

Страница 75: ...XXXX The basic version Repair ManualV1 0 internal public 2013 09 25 华为机密 未经许可不得扩散 第 75 页 共 79 页 9 4 10 CAM Circuit Principle Diagram ...

Страница 76: ... U00 supports 300W camera and 30W camera MT6572 through the data signal and the synchronization signal and the module of communication Fault analysis and treatment process The camera if the fault cannot be opened when the first investigation power supply and VCAMD MCLK if we can read ID then the remaining signal line ...

Страница 77: ...ead ID camera inversion Check whether the normal power supply measure the relationship between BBIC and camera BTB linker Check the VCAMD signal SDA SCL are normal Check the main clock MCLK are normal Replace LDO Replace BBIC Replace the camera connector Check the control signal are normal Check whether the normal data signals END Y Y Y N Y N N N ...

Страница 78: ... 华为机密 未经许可不得扩散 第 78 页 共 79 页 9 4 11 BT WIFI FM GPS Failure Y511 U00 is using BT WIFI FM GPS four in one chip MT6627 the above four functions from a chip so there are three functional abnormalities first investigation is MT6627 working properly Circuit Principle Diagram ...

Страница 79: ...en the investigation to the chip end measuring the conductivity 3 if the RF channel no abnormalities can check if there is a problem of antenna weld welding or direct replacement chip 9 4 12 Other common Failure 1 Sensor failure analysis method is relatively simple general for the chip is damaged or faulty re welding or replacement of the chip can be 2 The touch screen if there can not touch touch...

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