Huawei RH8100 V3, Руководство пользователя

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Chip Size Quantity of Thermal Compound
40 mm x 40 mm
(1.57 in. x 1.57
in.)
0.3 ml
30 mm x 30 mm
(1.18 in. x 1.18
in.)
0.2 ml
20 mm x 20 mm
(0.79 in. x 0.79
in.)
0.15 ml
Figure 5-9 shows the methods for pasting thermal compound. These methods are
described as follows:
●
Single-point pasting: for a small socket.
● Single-line pasting: for a long socket.
● Dual-line pasting, cross pasting, five-point pasting, and S-shape pasting apply
to a large square socket.
Figure 5-9 Pasting methods
Step 6 Use a clean card to smear the thermal compound over the entire center of the
CPU.
The thermal compound layer is as thick as a common piece of paper.
Figure 5-10
shows the smeared thermal compound layer. Ensure that the thermal compound is
painted evenly and fully.
RH8100 V3 Server
User Guide 5 Removing and Installing Parts of the RH8100 V3
Issue 30 (2019-12-19) Copyright © Huawei Technologies Co., Ltd. 122