
Figure 4-12 Components
1
I/O module 1
2
I/O module 2
3
PSUs
4
Chassis
5
Supercapacitor bracket
6
Air duct
7
Front drive backplane
8
Fan module brackets
9
Fan modules
10
Front drives
11
Cable organizers
12
Heat sinks
13
DIMMs
14
Mainboard
15
RAID controller card
16
FlexIO
17
iBMC card
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-
● I/O module 1 can be configured with a rear drive module with two 2.5-inch drives or a
PCIe riser module (PRM). I/O module 2 can be configured with a rear drive module with
two 2.5- or 3.5-inch drives. I/O module 3 cannot be used.
● The FlexIO can be configured with a TM210 NIC.
● CPU is integrated on the mainboard and cannot be replaced independently.
TaiShan 200 Server
White Paper (Model 2180)
4 Hardware Description
Issue 02 (2020-06-22)
Copyright © Huawei Technologies Co., Ltd.
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