HTC confidential
© 2004, HTC Corporation. All rights reserved.
TOTAL 69 CONT.ON. 64 PAGE NO. 63
Chapter 13- Board Level Repair
you are authorized by HTC to perform board level repair , you could ask below material/parts from
roblem Identification & Troubleshooting
Step 1.
Place the solder-proof tape to cover the surrounding area of the components which being replaced.
void the tape melted and make the component
nts.
ents could be gone when the solder-proof tape been taken off.
If
HTC .
13.1 P
(1) Basic Repair Instructions for Component Replacement
:
Warning
:
DO NOT overheat the tape and components to a
damage.
Step 2.
Use Heater Gun (HAKO850B, set the temperature between 350
℃
, Air Speed 3~5) to remove the
compone
Step 3.
It has to wait the temperature cool down before the damaged components been removed. Or, the
others compon
Step 4.
After the damaged component has been replaced, clear the surroundings for solder and flux
residues.
Содержание Hurricane Series
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