MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T-10
Torx Driver
T-15
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery
– Locate the battery on the system Board, use fingers to remove the battery and dispose of
properly.
2. Mega cell
– Pull the mega cell holder to get them out of the chassis and dispose of properly.
3.
– Remove the PSU from the system. Remove the screws securing the top cover, locate the
capacitors and use a medium flat head screwdriver to remove them and dispose of properly.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1
– 13 Cap Location in PSU
Attachment 14 System Battery Location
Attachment 15 Mega cell Holder Location
