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MF877-00                                                                                                Page  2 
Template Revision C, 30-July-2018 

 

Copyright 2018 Hewlett Packard Enterprise Development LP

 

HPE instructions for this template are available at 

MF877-01

  

Item Description 

Notes 

Quantity 
of items 
included 
in product

 

Components, parts and materials containing 
refractory ceramic fibers 

            

           

Components, parts and materials containing 
radioactive substances 

            

           

2.0 Tools Required

 

List the type and size of the tools that would typically be used to disassemble the product to a point where components 
and materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Torque Driver (Standard) 

            

Torque Bit 

 T10 

Torque Bit 

 T25    

Torque Bit 

 M4 Philip 
Head  

Cutter  

            

S

oldering Station

 

 

3.0 Product Disassembly Process

 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:  

1.  Remove PULL OUT 
2.  Unscrew and remove – M5 SCREW at 1 Location 
3.  Unscrew and remove – M3 SCREW at 14 Locations and CHASSIS COVER  
4.  Remove – INSULATOR from CHASSIS COVER 
5.  Cut and remove – CABLE TIE at 2 location 
6.  Unplug - AC connector from POWER SUPPLY 
7.  Unplug – Cable connect between POWER SUPPLY and PCBA, MAIN BOARD 
8.  Unplug – POWER SUPPLY connector from 

PCBA, MAIN BOARD

 

9.  Unplug - FAN connector from PCBA, MAIN BOARD 
10.  Remove – FAN CABLE from COVER, COMMON DIVERTER 
11.  Unplug –FFC CABLE from PCBA, LED BOARD 
12.  Unscrew – M3 SCREW at 2 Locations  
13.  Unscrew – M3 SCREW at 4 locations 
14.  Remove – CABLE and SHIELD PSU CABLE from CHASSIS 
15.  Slide out the POWER SUPPLY connector through the window opening slowly 
16.  Remove – POWER SUPPLY from CHASSIS 
17.  Unscrew and remove – M4 

SCREW at 1 Location

 

18.  Unplug –FFC CABLE from PCBA, MAIN BOARD 
19.  Unscrew and remove – M3 SCREW at 2 locations 
20.  Remove - PCA, LED BOARD 
21.  Remove - PUSHBUTTON 
22.  Unscrew and remove – M4 

SCREW at 6 Locations and FAN

 

23.  Unplug and remove - AC socket from CHASSIS 
24.  Remove – COIN BATTERY from BATTERY SOCKET   
25.  Unscrew and remove – M3 SCREW at 11 Locations and PCBA, MAIN BOARD 
26.  Remove - INSULATOR from CHASSIS  

Содержание Aruba 6200F

Страница 1: ...thin the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 3 Batteries All types including standard alkaline and lithium coin or button style batteries 1 Mercury containing components For example mercury in lamps di...

Страница 2: ...M5 SCREW at 1 Location 3 Unscrew and remove M3 SCREW at 14 Locations and CHASSIS COVER 4 Remove INSULATOR from CHASSIS COVER 5 Cut and remove CABLE TIE at 2 location 6 Unplug AC connector from POWER SUPPLY 7 Unplug Cable connect between POWER SUPPLY and PCBA MAIN BOARD 8 Unplug POWER SUPPLY connector from PCBA MAIN BOARD 9 Unplug FAN connector from PCBA MAIN BOARD 10 Remove FAN CABLE from COVER CO...

Страница 3: ...N DIVERTER from CHASSIS 28 Remove FRONT OVERLAY from CHASSIS 29 Desolder and Remove Capacitor from PSU PCBA 30 Remove SADDLE CABLE from SHIELD PSU CABLE 3 2 Optional Graphic If the disassembly process is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations 1 3 3 3 2 3 ...

Страница 4: ...MF877 00 Page 4 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 4 5 5 ...

Страница 5: ...MF877 00 Page 5 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 6 7 9 8 11 10 10 ...

Страница 6: ...MF877 00 Page 6 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 12 12 13 14 15 ...

Страница 7: ...MF877 00 Page 7 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 16 17 18 19 19 ...

Страница 8: ...MF877 00 Page 8 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 22 23 21 20 ...

Страница 9: ...MF877 00 Page 9 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 24 25 26 26 ...

Страница 10: ...MF877 00 Page 10 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 27 28 ...

Страница 11: ...MF877 00 Page 11 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 30 29 ...

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