HP ZHAN 99 Pro G1, Инструкция по разборке

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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description Ph2 screw driver (Disassemble 1 pcs screws for access panel)
T15 1.5~2.0
kgf-cm
Description T15 screw driver (Disassemble 4 pcs screws for side brkt and lower case)
T15 3.0~4.0
kgf-cm
NA NA
Description T15 screw driver (Disassemble 2 pcs screws for PCI cover and main bkt)
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 6 pcs screws for MB and main bkt)
T15 3.0~4.0
kgf-cm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove to lower case from housing.
2. Pull off ODD SATA con &ODD power con.
3. Remove ODD from housing and loosen 4 screws to remove HDD
4. Remove front bezel from housing
5. Loosen 4 screw on side bkt then remove it
6. Pull off all cables on MB
7. Remove PCI card from housing
8. Pull off PSU con
9. Loosen 4 screws on MB then remove it
10. Loosen 3 screws on PSU then remove it
11.
12.
13.
14.
15.
16. .
17. .
18.
19.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).