EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size ( if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove the Stand-base
2.
Remove the Rear cover
3.
Remove the pin and the screw
4.
Remove the the tapes and the pins.
5.
Remove the screws
6.
Remove the Mylar
7.
Remove the mainboard and powerboard
8.
Remove the The mainframe
9.
Remove the keyboard &bezel & panel
10.
11.
12.
13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment ( with descriptions and arrows identifying locations) .
