EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2 screwdriver
PH2
Description #3
Hex nut screwdriver
M5
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Quick release Base stand
2.
Strip the screws from rear cover so that the rear metal cover can be removed , after be turn back
3.
Strip the keypad line and led line and all tapes
4.
To remove the shielding(contain the other material )
5.
Strip the screws from PCBA
6.
Release all materials
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Below action which may easily damage product .please notice it
Lay the
Monitor on
the desk, tack
out the stand
Cuspa
te
thing
1
Unlock the
4 PCS
screws
#1
Cross
ing
Scre
w
driver
2
Take out the
back cover
with hand.
N/A
3
