EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on a flat, soft and clean surface.
2. Remove the Base ASSY..
3. Remove the screws.
4. Remove the cover
5.
6. Remove the Pins and white tape
7. remove the speakers..
8. Remove the Mainframe and the pins.
9. Remove the Panel
10. Remove the boards.
11. Remove the pins
12. Remove the tape
13. Remove the the screws and the pin.
14. Remove the mainboard connect pin and the USB board connect pin
15.
16.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
