HP ProOne 490 G3 Скачать руководство пользователя страница 2

EL-MF877-00                                                 Page  2 
Template Revision B  

                 

 

 

 

 

  

PSG instructions for this template are available at 

EL-MF877-01

  

Components, parts and materials containing 
radioactive substances 

            

           

2.0 Tools Required

 

List the type and size of the tools that would typically be used to disassemble the product to a point where components 
and materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Description #1 Screwdiver    

 TORX T8 

Description #2  

            

Description #3  

               

Description #4  

             

Description #5   

            

3.0 Product Disassembly Process

 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:  

1.   Removed Stand base 
2.   Removed Rear Cover 
3.   Removed Hinge 
4.   Removed Converter board & others 
5.    Removed HDD module 
6.   Remove MB Shielding  
7.   Removed Thermal module  
8.   Removed Fan module  
9.   Removed Base pan 
10.   Removed MB       
11.   Removed Speaker module 
12.   Removed Camera module 
13.   Removed Speaker Grill 
14.   Removed LCD panel 

3.2 Optional Graphic.  If the disassembly process is complex, insert a graphic illustration below to identify the items 
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

 
1.  Removed Stand base 

 

 
 
 
 
 

Содержание ProOne 490 G3

Страница 1: ...t Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm Motherboard RAM 2 Transform board 4 Batteries All types including standard alkaline and lithium coin or button style batteries RTC battery 1 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries Liquid Crystal Displays LCD with a surface greater than 100 sq c...

Страница 2: ...duct Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 1 Removed Stand base 2 Removed Rear Cover 3 Removed Hinge 4 Removed Converter board others 5 Removed HDD module 6 Remove MB Shielding 7 Removed Thermal module 8 Removed Fan module 9 Removed Base pan 10 Removed MB 11 Removed Speaker module 12 Removed C...

Страница 3: ...EL MF877 00 Page 3 Template Revision B PSG instructions for this template are available at EL MF877 01 2 Removed Rear Cover 3 Removed Hinge 4 Removed Converter board others 5 Removed HDD module ...

Страница 4: ...EL MF877 00 Page 4 Template Revision B PSG instructions for this template are available at EL MF877 01 6 Removed MB Shielding 7 Removed Thermal module 8 Removed Fan module ...

Страница 5: ...EL MF877 00 Page 5 Template Revision B PSG instructions for this template are available at EL MF877 01 9 Removed Base pan 10 Removed MB 11 Removed Speaker module 12 Removed Camera module ...

Страница 6: ...EL MF877 00 Page 6 Template Revision B PSG instructions for this template are available at EL MF877 01 13 Removed Speaker Grill 14 Removed LCD panel ...

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