EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T10
Torx Driver
T15
Torx Driver
T20
Philips
#2
Flat head screw driver
Medium
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Capacitors=>2.5CM - Remove the power supply from the system. With #2 Philips screw driver, remove the screws
securing the top cover, then locate the capacitors and pry from the PCB with a medium flat head screw driver and
dipose of properly
2. System Board Battery - Remove the top cover and locate the battery on the system board. With a medium flat head
screw driver remove the battery and dispose of properly
3.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1~8 Capacitor location by model number of supply
Attachment 9 System Battery Location
