EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T10
Torx Driver
T15
Torx Driver
T20
Flat head screw driver
Medium
Soldering Iron
TPK936
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Remove the top cover and locate the battery on the system board. With a medium flat head
screw driver, remove the battery and dispose of properly.
2. Capacitors > 2.5CM
– Remove the power supply(s) from the system. With #2 Philips screw driver remove the screws
securing the top cover and the heatsinks in the P/S then locate the capacitors and pry from the PCB with a medium flat
head screw driver and dispose of properly
3.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1-2 System Battery and Megacell Battery Location
Attachment 3-6 –Electrolytic capacitors location in the power supply per Model Number.
